Illustrative examples of forming and using suitably adapted materials for improving interface strength between thermoset-thermoplastic joined parts includes exposure of a thermoplastic substrate to a plasma to form an amine-functionalized substrate having amine chemical moieties disposed on a first surface. The first surface of the thermoplastic substrate is positioned adjacent to and contacts a second surface of a thermoset substrate to form a workpiece. The thermoset substrate includes epoxide chemical moieties on and within material forming the thermoset substrate. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first surface of the thermoplastic substrate and the second surface of the thermoset substrate. Thereafter, additional thermoplastic components can be fusion bonded to a surface of the thermoplastic substrate opposite the first surface—thereby providing improved attachment of additional thermoplastic components to the thermoset substrate.

A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H.sub.2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.

Illustrative examples of forming and using suitably adapted materials for improving interface strength between thermoset-thermoplastic joined parts includes exposure of a thermoplastic substrate to a plasma to form an amine-functionalized substrate having amine chemical moieties disposed on a first surface. The first surface of the thermoplastic substrate is positioned adjacent to and contacts a second surface of a thermoset substrate to form a workpiece. The thermoset substrate includes epoxide chemical moieties on and within material forming the thermoset substrate. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first surface of the thermoplastic substrate and the second surface of the thermoset substrate. Thereafter, additional thermoplastic components can be fusion bonded to a surface of the thermoplastic substrate opposite the first surface—thereby providing improved attachment of additional thermoplastic components to the thermoset substrate.

A method of manufacturing a composite member including an aluminum member and a resin member bonded to each other, the method including: performing blasting on a surface of the aluminum member; modifying the surface of the aluminum member into aluminum hydroxide, the modifying including causing the surface of the aluminum member having undergone blasting to react with water by using at least one of heat and plasma; and directly bonding the resin member to the surface of the aluminum member modified to the aluminum hydroxide.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A method for bonding two elements, the method including receiving first and second elements, the first element being a composite material; applying a laser-based treatment to a surface of the first element to obtain a treated surface; patterning the treated surface to have plural trenches; applying an adhesive to one of the first and second elements; and joining the first element to the second element so that the adhesive is between the first and second elements.

A method of directly joining a polymer to a metal along a joint interface through the formation of C—O—M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; and applying force to the joint interface of the metal and the polymer to generate intimate atomic contact between the metal and the polymer to create C—O—M chemical bonds between the metal and the polymer.

The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 .Math.m.

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

In the present invention, a fluid handling device has: a first substrate made of resin whereon a channel is formed in a first surface; a first film made of resin and joined to the first surface of the first substrate; a second film made of resin a first surface of which is joined to a second surface of the first substrate; and a second substrate made of resin and joined to a second surface of the second film. A recessed part overlapping the channel in a plane view is formed on the surface of the second substrate joined to the second film. The glass transition temperature Tg.sub.1s of the first substrate, the glass transition temperature Tg.sub.1f of the first film, the glass transition temperature Tg.sub.2s of the second substrate, and the glass transition temperature Tg.sub.2f of the second film satisfy Tg.sub.1s, Tg.sub.2s>Tg.sub.1f, Tg.sub.2f.