Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.

A system and method for thermoplastic composite welding comprising a cooling means and a heat source. The cooling means cools a heat-side laminate so as to create a thermal gradient in the heat-side laminate. The heat source heats the heat-side laminate after the cooling step is initiated but before the thermal gradient dissipates so that a first side of the heat-side laminate closer to the heat source does not deform as faying surfaces of the heat-side laminate and another laminate farther away from the heat source are welded together.

In certain examples, a machine that forms a web into bags or pouches includes a sealing section through which the web is conveyed in a machine direction. The sealing section is configured to form a lap seal in the web and has an input end configured to receive the web which has a first web section and a second web section. An ultrasonic sealer with a horn and an anvil defines a nip therebetween through which the first web section passes. The ultrasonic sealer is configured to form the lap seal in the first web section. The anvil is positioned between the first web section and the second web section. An output end is configured to dispense the web with the lap seal formed therein.

A resistance welding apparatus can employ a modular power supply system with multiple power supply modules and leads for electrically connecting the modular power supply system to a welding resistor. The resistance welding apparatus is selectively configurable in at least three of (i) a first configuration in which the leads connect the first power supply module to the resistor and the second power supply module is disconnected from the resistor; (ii) a second configuration in which the leads connect the second power supply module to the resistor and the first power supply module is disconnected from the resistor; (iii) a third configuration in which the leads connect the first and second power supply modules to the resistor in series; and (iv) a fourth configuration in which the leads connect the first and second power supply modules to the resistor in parallel.

The present invention relates to a method for ultrasonic treatment of a plastic material, comprising the steps of: positioning the plastic material between a sonotrode and a counter-tool, bringing the sonotrode excited by means of an ultrasonic oscillation into contact with the plastic material during a welding phase, moving the sonotrode and the counter-tool towards each other during a holding phase, in which neither the sonotrode nor the counter-tool are excited with an ultrasonic oscillation so that a force F is applied onto the plastic material. In order to reduce treatment times, wherein at the same time the quality of the welding process is not impaired but is even to be improved, it is proposed according to the invention that the force F is varied during the holding phase.

The invention relates to a method for producing strapping. A strapping band (4) is first guided about at least one packaging piece, tightened, and equipped with a closure at band ends (4a, 4b) to be connected in a closure unit (1). Furthermore, at least one sensor (7) connected to a control unit (8) is provided in the closure unit (1). One or more closure parameters are detected by means of the control unit (8) using the sensor (7), and the closure unit (1) is correspondingly actuated. According to the invention, the sensor (7) is designed as a load cell (7) which is let into a compression ram (6a, 6b) of the closure unit (1).

The purpose of the present invention is to provide a heat-sealing device capable of preventing problems associated with cap sealing performance and/or sensation of the cap being open due to an inappropriate cap temperature. For this purpose, this heat-sealing device (10), which is used in a manufacturing apparatus (100) for manufacturing a product for which an opening part (1A: mouth part) of a container (1) is sealed with a cap (2), is provided with: a pressing plate (5) which is disposed on a path along which the containers (1) move; a heating unit (3) and sealing heads (4) for pressing the caps (2) sealing the container (1), the heating unit (3) and sealing heads (4) being arranged on the pressing plate (5); a temperature measurement device (7) for measuring the temperatures of the sealing heads (4); and a control device (8: control unit) for transmitting control signals to a container conveyance drive source (for example, inverter) in accordance with the measurement results from the temperature measurement device (7).

A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

The invention relates to an apparatus and to a method for establishing a connection having material continuity or having material continuity and shaping matching or for separating such a connection of at least one metal or ceramic component and of a component formed from or by a thermoplastic polymer in which the components to be joined together can be pressed together by a pressing device having a counterholder and a plunger. A heating device is present at the plunger and/or at the counterholder or acts there. A heating of the at least one metal or ceramic component up to above the softening temperature of the component formed from or by polymer can be achieved with the heating device, with the heating device being having at least one electrical resistance heating element that is covered by an electrically insulating, preferably ceramic, protective film, and/or having at least one laser beam that is directed to the metal component(s) within the joining region, and/or having at least one inductor present at the plunger and/or at the counterholder for the inductive heating of the meal component(s).

An active anvil assembly for use in forming a looped suture is provided. The active anvil assembly includes an anvil member, a first sensor operably connected to the anvil member, and a control assembly. The first sensor is configured for measuring at least one of force, torque, and distance feedback. Also provided are systems and methods for forming a looped suture including an active anvil assembly.