A press pad for use in lamination of multi-layer circuit boards is disclosed. The press pad includes: a planar pad having a first surface and a second surface opposite to the first surface; and a sheet of release film coupled to the first surface, wherein the release film sheet is coupled to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate, and wherein the release film sheet comprises polyimide-based film.

A hot press cushioning material includes a base material layer that is in the form of a plate and that contains fibers; and an end face seal covering an outer end face of the base material layer. The end face seal includes a heat resistant elastic body having penetrated the outer end face of the base material layer and a heat resistant resin attached to an outer surface of the heat resistant elastic body.

A hot press cushioning material includes a cushioning material body in the form of a plate; and surface materials provided on the front and back sides of the cushioning material body. The surface material includes a core layer composed of a heat resistant fiber material for a nonwoven structure, and a front-side resin layer covering the entire front side of the core layer. The core layer has an air permeability of 5 cm.sup.3.Math.cm.sup.−2.Math.s.sup.−1 or less and a bulk density of 0.8 g/cm.sup.3 or more.

A system for curing a thermoset composite may include a tooling die configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure media bag configured to be placed over the uncured thermoset composite part disposed on the tooling die and including a pressure media; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed on the tooling die, the pressure media bag may be configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed on the tooling die.

The die cushion device includes a first hydraulic cylinder for supporting a cushion pad, and a first hydraulic circuit for driving the first hydraulic cylinder. The first hydraulic circuit is a hydraulic closed circuit including a logic valve connected between a die cushion pressure generation line and a system pressure line, and a hydraulic pump driven by a first servomotor for applying a pilot pressure to the logic valve. The first controller controls the first servomotor (pilot pressure) based on a first pressure command corresponding to the die cushion force and the pressure detected by the first pressure detector to control the pressure in a lower chamber of the first hydraulic cylinder so that the pressure is equal to a pressure corresponding to the first pressure command.

A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface; cleaning the planar pad, the cleaning including electrostatically removing particulates from the first and second surfaces of the planar pad; and attaching a first release film sheet to the first surface and a second release film sheet to the second surface, the release film sheets being attached to the first and second surfaces using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

Disclosed is a buffer component and a pressing device, the buffer component is applied to the pressing device. The pressing device includes an anisotropic conductive film pressure knife, the buffer component includes an inserting part, which is made of a first elastic material, and the inserting part is configured to insert into a lower end of the anisotropic conductive film pressure knife; and a buffering part, which is made of a second elastic material, the buffering part is configured to closely attach to a lower end surface of the lower end of the anisotropic conductive film pressure knife.

This disclosure relates to rechargeable battery packs and or rechargeable battery modules consisting of electrochemical cells in general and more specifically to lithium metal anode secondary electrochemical cells and the supporting mechanical structure of such packs or modules which apply and maintain a high and uniform normal compression pressure to the face of the interconnected cells of said battery packs, modules or individual cells, in order to suppress dendrite formation during charge and maintain a low cell impedance during charge and discharge. This is achieved with the use of a compression assembly having a compressible sheet with desired properties.

Provided is a laminating apparatus configured to improve the uniformity of the thickness of a laminate to be obtained to improve the yield of a product, such as a laminate. The laminating apparatus includes a pressing device including a first press block that is advanceable and retreatable, a second press block arranged to face the first press block, a first pressing rubber mounted inside the first press block, and a second pressing rubber mounted inside the second press block, the first pressing rubber and the second pressing rubber facing each other, the first pressing rubber having formed on a surface thereof facing the second pressing rubber a convex frame configured to surround a peripheral edge portion thereof.