Described herein is a building panel comprising a body comprising a first fibrous material comprising inorganic fiber, a non-woven scrim coupled to the body; and wherein the non-woven scrim has a thickness ranging from about 8 mils to about 20 mils.

The present invention relates to a multilayer film including at least one film surface which has an increased surface roughness achieved by protrusion creating particles. The at least one film surface may have a surface roughness characterized by a coefficient of roughness (CR) of ≥0.02 or a Parker Print Surf roughness of at least 2 μm.

An object of the present invention is to provide a heat-resistant film that is suitable for protection of a surface provided with electrical conduction, decoration or the like in a plastic product, a glass product, a ceramic product, and the like, or that is suitable for holding a semiconductor, dies, and the like in producing dies through dicing and singulation. The film that solves the above object is a heat-resistant film comprising a thermoplastic resin, wherein (a) the thermoplastic resin is a polyester-based elastomer comprising a hard segment and a soft segment that are linked to each other, (b) the hard segment comprises a polyester unit constituted from an aromatic dicarboxylic acid and an aliphatic diol or an alicyclic diol, (c) the soft segment is constituted mainly from the prescribed polycarbonate, (d) a weight ratio of the hard segment contained in the polyester-based elastomer exceeds 50%, and (e) the film comprising the thermoplastic resin has an elastic modulus of 30 to 500 MPa, an elongation at break of 200 to 700%, and a ratio F50/F25 of 1.05 or more, the ratio F50/F25 being a ratio of a stress F50 at an elongation of 50% to a stress F25 at an elongation of 25%.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole;

removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller;
transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric;
bonding the foam and the fabric by compressing; and
cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

Disclosed is a plasticized cellulose ester composition. The plasticized cellulose ester composition of the present invention includes a plasticized cellulose ester and an effective amount of an inorganic rheological modifier having a refractive index that differs from the refractive index of said plasticized cellulose ester an amount no more than 0.03 refractive index units. Related articles are also described.

Implementations for composite display cover are described and provide improved protection and durability to device displays as compared with conventional display protection technologies. The described composite display cover, for instance, utilizes an ultra-thin glass layer with a polymer film applied directly to the glass layer and a hard coat applied to the polymer film. The polymer film, for instance, is applied to the glass layer without an adhesive. Further, the composite display cover can be attached to a display, such as via an adhesive layer that adheres the glass layer to a surface of the display.

The invention provides a synthetic slip-resistant floor-covering material comprising a layer of synthetic material which contains one or more degradable polymeric particles wherein the one or more degradable polymeric particles comprise: (a) one or more hard degradable polymeric particles which have a hardness which is greater than the hardness of the layer of synthetic material; and optionally (b) one or more soft degradable polymeric particles which have a hardness which is the same as or less than the hardness of the layer of synthetic material; and wherein the one or more hard degradable polymeric particles comprise one or more exposed hard degradable polymeric particles which are exposed at an upper surface of the synthetic floor-covering material to provide slip-resistance; and a method of preparing a synthetic floor-covering which method comprises the steps of: Providing a layer of synthetic material; Applying the one or more degradable polymeric particles to the layer of synthetic material; and Applying pressure to the layer of synthetic material to ensure that the one or more degradable polymeric particles are incorporated into the layer of synthetic material.

A method for manufacturing a polyester film for embossing that is made from a recycled polyester material. A part of the recycled polyester material is physically reproduced to obtain physically regenerated polyester chips. The physically regenerated polyester chips include physically regenerated regular polyester chips. Another part of the recycled polyester material is chemically reproduced to obtain chemically regenerated polyester chips. The chemically regenerated polyester chips include chemically regenerated regular polyester chips and chemically regenerated electrostatic pinning polyester chips. The physically regenerated polyester chips and the chemically regenerated polyester chips are mixed to form a base material. The base material is used to form a base layer that having a main component of regenerated polyethylene terephthalate. A surface coating layer is formed onto the base layer. A material of the surface coating layer includes a main resin, fillers, and melamine.

Disclosed is a joined ceramic body comprising a first ceramic portion comprising a first ceramic, a second ceramic portion comprising a second ceramic, and a joining layer formed between the first ceramic portion and the second ceramic portion. The joining layer has a bond thickness of from 0.5 to 20 um and comprises silicon dioxide having a total impurity content of 20 ppm and less. A method of making the joined ceramic body and a joining material are also disclosed.