A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.

The present specification relates to a joint body of different materials, and a method of manufacturing the same. The joint body includes a metal layer; and a resin layer provided on and in contact with one surface of the metal layer. The metal layer comprises two or more etching grooves and two or more burrs provided on a surface of the metal layer adjacent to the etching grooves.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Embodiments of the present disclosure provide a display substrate motherboard and a manufacturing method and a cutting method thereof, a display substrate and a display device. The display substrate motherboard includes a preset cutting position, a back film and an adhesive layer disposed on the back film, the adhesive layer includes: a first adhesive layer corresponding to the preset cutting position; a second adhesive layer disposed on two sides of the first adhesive layer in a direction parallel to the back film; and a first light blocking layer disposed between the first adhesive layer and the second adhesive layer, wherein the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer.

A composite pane with at least one functional element, includes a first pane including an inner side III and an outer side IV, a second pane including an inner side II and an outer side I, a thermoplastic intermediate layer that joins the inner side III of the first pane laminarly to the inner side II of the second pane, at least one functional element that is incorporated into the thermoplastic intermediate layer, wherein the at least one functional element is directly adjacent the inner side III of the first pane and/or the inner side II of the second pane, and a deaeration structure is mounted at least in the region of the functional element that is directly adjacent the first pane and/or second pane.

A foil transfer device includes a first projector projecting light toward a foil film, and a second projector projecting light toward the foil film. The second projector and the first projector are staggered relative to each other.

The current invention concerns coverings such as a floor covering, wall covering or ceiling covering, said covering comprising at least one substrate and at least one surface layer, said surface layer comprising a print pattern and a wear layer, whereby said print pattern is directly applied to said substrate, and further concerns a method to produce such coverings.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the first layer including a thermoplastic resin layer that is releasably adhered to the wafer's front surface; and the second layer including a photo-curing siloxane polymer layer laminated on the first layer. A wafer processing laminate, a temporary adhesive material for wafer processing, and a method for manufacturing a thin wafer using the same, which suppress wafer warpage at the time of heat-bonding, have excellent delaminatability and cleaning removability, allow layer formation with uniform film thickness on a heavily stepped substrate, are highly compatible with steps of forming TSV, etc., have excellent thermal process resistance, and are capable of increasing productivity of thin wafers.

A flexible sheet having enhanced thermal conductivity, electrical isolation and bonding strength includes a first layer of polyethylene terephthalate having opposed first and second sides and an electrical isolation of at least 500 ohms at 2.0 kV DC, and a second layer of heat-activated adhesive attached to and covering the first side. The heat-activated adhesive has a bonding strength of greater than 50 psi, and the first and second layers together have a thermal conductivity of at least 0.7 W/mK. A thermal cooling structure for use with high-voltage battery applications includes the first layer of polyethylene terephthalate, the second layer of heat-activated adhesive, a third layer of thermal interface material attached to and covering the second side of the first layer, and a metallic cooling plate attached to the second layer.