Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.
0.12<{(a1+a2)/2}/B  (1)
0.8≤a1/a2≤1.25  (2)

An object is to provide a coloring technique that makes it possible to impart luster while providing a vivid color, and further to provide a coloring technique that makes it possible to retain more unevenness when a substrate has unevenness. This object is achieved by a laminated sheet comprising a fiber substrate and a metalloid element-containing layer disposed on or above the surface of the fiber substrate.

An object is to provide a coloring technique that makes it possible to impart luster while providing a vivid color, and further to provide a coloring technique that makes it possible to retain more unevenness when a substrate has unevenness. This object is achieved by a laminated sheet comprising a fiber substrate and a metalloid element-containing layer disposed on or above the surface of the fiber substrate.

A process for producing a carbon sheet molding compound (SMC). An SMC manufacturing line including at least one conveyor line for laying up SMC resins on a carrier film is provided. A chopped carbon fiber which is evenly distributed using dehumidified supply air and using a pressurized air venturi apparatus which is used to debundle and randomize the carbon fibers, onto the resin on the carrier film as the carrier film moves along the conveyor.

A process for producing a carbon sheet molding compound (SMC). An SMC manufacturing line including at least one conveyor line for laying up SMC resins on a carrier film is provided. A chopped carbon fiber which is evenly distributed using dehumidified supply air and using a pressurized air venturi apparatus which is used to debundle and randomize the carbon fibers, onto the resin on the carrier film as the carrier film moves along the conveyor.

Grid structure, such as a lattice or grid-stiffened structure and a process of manufacturing such a grid structure. Fiber material is laid up on a base tool to form intersecting ribs defining a grid with a plurality of cavities. In the same step fiber material is laid to form one or more; local substructures. Blocks are placed, at the positions of the cavities. The fiber material of the ribs and. the local substructures is impregnated with a resin. Optionally, one or more layers of fiber material are placed on the base tool and/or over the ribs and the blocks to form an outer skin. The ribs, the local substructure and optionally the outer skin jointly consolidated to form, the grid, structure.

The present invention relates to a ceramized silicone resin composition and a pre-preg and a laminate that use the composition. The ceramized silicone resin composition comprises: 50-100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, 5-80 parts of a ceramic-forming filler, and 0.01-50 parts of a flux. The pre-preg and the laminate manufactured using the ceramized silicone resin composition, when used in a sustained high temperature, can transform into complex ceramized structure thereby providing ceramic properties, thus providing great fireproof and flame retardant effects; also, manufacturing of the laminate is similar to that of a regular FR-4 laminate, where the process is easy to operate. The ceramized silicone resin composition, the pre-preg, and the laminate have the advantages of being halogen-free, low smoke, low toxicity, flame retardant, and fireproof, provide a novel concept and a novel method in terms of flame retardancy and fire resistance, accelerate the research progress in laminate passive fire protection technology, and have broad prospects in the field of fire protection and fire resistance.

The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).