Patent classifications
B32B27/325
Multilayer, Heat-Shrinkable Film Comprising a Plurality of Microlayers
A multilayer, heat-shrinkable film generally includes at least one bulk layer and a microlayer section comprising a plurality of microlayers. The film has a sufficiently low shrink force to wrap fragile items, such as furnace filters.
Transparent conducting film laminate and processing method thereof
Provided are a transparent conducting film laminate to which a curl generated during a heating step and after the heating step can be controlled, and a method for processing the same. A transparent conducting film laminate comprises a transparent conducting film 20 and a carrier film 10 stacked thereon, wherein the transparent conducting film 20 comprises a transparent resin film 3, transparent conducting layer 4, and an overcoat layer 5 stacked in this order, the transparent resin film 3 having a thickness T.sub.1 of 5 to 25 μm and being made of an amorphous cycloolefin-based resin, the carrier film 10 is releasably stacked on the other main face, the face opposite to the face having the transparent conducting layer 4, of the transparent resin film 3 with an adhesive agent layer 2 therebetween, and a protection film 1 has a thickness T.sub.2 which is 5 times or more of the thickness T.sub.1 of the transparent resin film 3 and is 150 μm or less, and is made of polyester having an aromatic ring in its molecular backbone.
Film capacitor, film-capacitor film, and method for manufacturing film-capacitor film
A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.
REGIOSELECTIVELY SUBSTITUTED CELLULOSE ESTERS AND FILMS MADE THEREFROM
Regioselectively substituted cellulose esters having a plurality of pivaloyl substituents and a plurality of aryl-acyl substituents are disclosed along with methods for making the same. Such cellulose esters may be suitable for use in films, such as +A optical films, and/or +C optical films. Optical films prepared employing such cellulose esters have a variety of commercial applications, such as, for example, as compensation films in liquid crystal displays and/or waveplates in creating circular polarized light used in 3-D technology.
MICROFLUIDIC SYSTEMS AND METHODS FOR SORTING PARTICLES
Provided herein are devices, systems, and methods for particle sorting, including cell sorting, using microfluidics cartridges and microchips and the manufacture of the microfluidics cartridges and microchips by high-throughput approaches. Such methods, devices, and systems can be used to identify, sort, and collect a subset of particles or a single particle from a sample. The capability to manufacture such microfluidic tools in high volume may lower production costs and allow for the microfluidic tools to be used as consumables.
LAMINATED GLASS
A laminated glass includes first and second glass plates. First and second interlayers are arranged on the first and second glass plates, respectively. The first and second glass plates are arranged so as to have the first and second interlayers face each other. An enclosing layer is arranged between the first and second interlayers. The enclosing layer includes a functional member having a sidewall, and a dummy layer arranged on the sidewall, the functional member including one or more transparent layers. The functional member has a thickness of 200 μm at a maximum. The dummy layer is made of a thermoplastic resin. When denoting an average refractive index of the transparent layers included in the functional member as nA, and denoting a refractive index of the dummy layer as nB, a difference Δn of the refractive indices expressed by an absolute value |nA−nB| is 0.05 or less.
Resin Sheet and Circuit Board Material Using the Same
A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.
LAMINATED GLASS
To provide laminated glass that can significantly reduce air bubbles remaining inside.
Laminated glass having a first glass substrate and a second glass substrate laminated to each other, which has a first interlayer disposed between the first glass substrate and the second glass substrate and being in contact with the first glass substrate, a second interlayer disposed between the first glass substrate and the second glass substrate and being in contact with the second glass substrate, first and second functional members disposed between the first interlayer and the second interlayer and being in contact with the first interlayer and the second interlayer, wherein the first and second functional members have a higher rigidity than the first and second interlayers, and the first and second functional members are spaced apart from each other by a distance d when the laminated glass is viewed in plan view, and said distance d is at least 15 mm.
Moisture barrier laminate
An object of the present invention is to provide a moisture barrier laminate including a moisture trapping layer that maximizes its moisture trapping performance and exhibits an excellent moisture barrier property. The moisture barrier laminate of the present invention includes a gas barrier film substrate A having a gas barrier layer a1 and a moisture trapping layer B formed on the film substrate A as a base. On a surface of the moisture trapping layer B opposite to the film substrate A, a protective resin layer C having a moisture permeability in a range of 4.0×10 to 5.0×10.sup.4 g/m.sup.2.Math.day at 40° C. and 90% RH is laminated.
Thermoformable multilayer films and blister packs produced therefrom
A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.