Disclosed is a method for producing panels from a board which includes dissecting the board along predefined lines. The board includes a core material board and is laminated with a laminate material layer. The board is dissected along an impressed region running linear over the complete surface of the laminate material layer. Also disclosed are a press plate, a method for the production of a board having an impressed region, and a board for producing the panels.

A plant for laminating cardboard, and in particular corrugated cardboard, by an adhesive plastics film, is provided. The plant has a supply station configured to supply a succession of single rough cardboard sheets in a feeding direction, an application station arranged in the sheet feeding direction and having an application roller configured to unwrap and apply the adhesive plastics film to a rough cardboard sheet so that the adhesive plastics film adheres to each rough cardboard sheet of the succession of rough cardboard sheets to form a succession of coated cardboard sheets and to advance each coated cardboard sheet of the succession of coated cardboard sheets in the feeding direction. A method for laminating cardboard, and in particular corrugated cardboard, using an adhesive plastics film is also provided.

A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

An assembly for producing cabinet doors including a CNC machine provided with a porous worktable, means for positioning workpieces thereon, means for applying a vacuum to such porous worktable for adhering such workpieces thereto and means for machining such workpieces adhered to such worktable; and means for thermally deforming a thermally pliable foil to laminate such workpiece.

A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.

A method for manufacturing a display panel includes providing a mother substrate that includes a display area and a non-display area, and includes a first substrate, a second substrate facing the first substrate, and a sealant provided between the first substrate and the second substrate, generating a crack on the sealant through irradiation of laser onto the sealant between the first substrate and the second substrate, and cutting a part of the second substrate and a part of the sealant at a position corresponding to the crack.

A display apparatus includes: a display panel including a display area, a peripheral area, a bending area, and a pad area; and a lower protection layer arranged on a rear surface of the display panel and including a first portion and a second portion, where the first portion corresponds to the display area and the peripheral area, and the second portion corresponds to the pad area. The first portion of the lower protection layer includes a material different from a material of the second portion. The display area is configured to display an image, the peripheral area is outside the display area and does not display an image, the bending area is on one side of the peripheral area, and the pad area is spaced apart from the peripheral area with the bending area therebetween.

A protective sheet sticking apparatus includes a cutting unit that cuts a protective sheet stuck to a wafer along an outer circumference of the wafer while bringing a cutting part of a cutting blade into contact with the outer circumference of the wafer. The cutting unit has a cutting blade support part that supports the cutting blade rotatably in such a manner that the direction of a cutting edge of the cutting part is adjustable from the outside in the radial direction of the wafer to the inside. The cutting blade support part includes a first biasing spring that makes biasing to cause the cutting part to be oriented toward the inside and a second biasing spring that makes biasing to cause the cutting part to be oriented toward the outside in order to prevent the cutting part from being oriented toward the inside by a predetermined angle or larger.

Methods of manufacturing electrochromic windows are described. Insulated glass units (IGU's) are protected, e.g. during handling and shipping, by a protective bumper. The bumper can be custom made using IGU dimension data received from the IGU fabrication tool. The bumper may be made of environmentally friendly materials. Laser isolation configurations and related methods of patterning and/or configuring an electrochromic device on a substrate are described. Edge deletion is used to ensure a good seal between spacer and glass in an IGU and thus better protection of an electrochromic device sealed in the IGU. Configurations for protecting the electrochromic device edge in the primary seal and maximizing viewable area in an electrochromic pane of an IGU are also described.

Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.