A transfer film has a temporary support, a first curable transparent resin layer, a second curable transparent resin layer in which the thickness of the first curable transparent resin layer is equal to or greater than 1 μm, the second curable transparent resin layer includes 5% by mass to 95% by mass of a metal oxide particle with respect to the solid content of the second curable transparent resin layer, and the first curable transparent resin layer does not include the metal oxide particle, or includes less amount of the metal oxide particle than the second curable transparent resin layer.

A method of manufacturing a pattern includes providing a pattern of a first liquid on a medium, applying a powder material to the provided pattern, and providing a second liquid to the powder material applied to the first liquid.

A method of manufacturing a pattern includes providing a pattern of a first liquid on a medium, applying a powder material to the provided pattern, and providing a second liquid to the powder material applied to the first liquid.

Pillar delivery films for vacuum insulated glass units are disclosed. The delivery films include a support film or pocket tape, a sacrificial material on the support film, and a plurality of pillars. The pillars are at least partially embedded in the sacrificial material or formed within sacrificial material molds, and the sacrificial material is capable of being removed while leaving the pillars substantially intact. Methods of transferring pillars to a substrate using the pillar delivery films are disclosed. In order to make an insulated glass unit, the delivery films are laminated to a receptor such as a glass pane, and the support film and sacrificial material are removed to leave the pillars remaining on the glass.

Pillar delivery films for vacuum insulated glass units are disclosed. The delivery films include a support film or pocket tape, a sacrificial material on the support film, and a plurality of pillars. The pillars are at least partially embedded in the sacrificial material or formed within sacrificial material molds, and the sacrificial material is capable of being removed while leaving the pillars substantially intact. Methods of transferring pillars to a substrate using the pillar delivery films are disclosed. In order to make an insulated glass unit, the delivery films are laminated to a receptor such as a glass pane, and the support film and sacrificial material are removed to leave the pillars remaining on the glass.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

The present invention includes a tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of fed component supply tape made from carrier tape and cover tape so as to peel the cover tape from the carrier tape, enabling a component to be supplied from at a component supply position, wherein the peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed. Accordingly, cover tape is reliably peeled without damaging components, and changeover work on the leading end of the component supply tape is not required.

The present invention includes a tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of fed component supply tape made from carrier tape and cover tape so as to peel the cover tape from the carrier tape, enabling a component to be supplied from at a component supply position, wherein the peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed. Accordingly, cover tape is reliably peeled without damaging components, and changeover work on the leading end of the component supply tape is not required.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.