A piezoelectric film includes a plurality of laminated main baking unit PZT layers. A first seed layer is present at a lower surface side of a lowermost main baking unit PZT layer. A second seed layer is interposed between two adjacent main baking unit PZT layers at an intermediate position between the lowermost main baking unit PZT layer and an uppermost main baking unit PZT layer.

According to an example, a fluid ejection device may include a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, in which the portioning wall physically separates the first column of firing chambers from the second column of firing chambers. The fluid ejection device may also include a plurality of actuators and a substrate including a respective hole extending through the substrate from each of the firing chambers, in which an actuator of the plurality of actuators is provided in each of the firing chambers.

A bonding substrate is provided with nozzle communication channels that establish communication between pressure chambers and nozzles. Each nozzle communication channel includes a pair of first inner wall surfaces constituting wall surfaces in a first direction, and a pair of second inner wall surfaces constituting wall surfaces in a second direction being orthogonal to the first direction. At least one of the second inner wall surfaces includes an inclined surface being inclined such that a length of the nozzle communication channel becomes gradually shorter toward the nozzle. An angle of the inclined surface relative to a liquid ejecting surface where the nozzles are opened is smaller than an angle of the first inner wall surface relative to the liquid ejecting surface.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.

An inkjet recording head comprising a flow channel member, wherein the flow channel member is formed of a heat-cured product of a molding material comprising a resin composition comprising a thermosetting epoxy resin and a curing agent, and a filler; the filler comprises alumina and silica; and with d50 as a median diameter of the silica and with alumina A as the alumina having a median diameter of d50/4 or less, the content of the alumina A is 11 parts by mass or more relative to 100 parts by mass of the silica.

A water-repellent member includes a base layer formed on the substrate, projections dispersedly arranged on the base layer, a first water-repellent material provided on the base layer in contact with the base layer, and a second water-repellent material provided on the projections in contact with the projections. The first water-repellent material and the second water-repellent material are perfluoropolyether compounds. An oxygen concentration of the base layer is lower than an oxygen concentration of the projections.

An ink set is an ink set including a cyan ink C1 which has a fluorescent brightening intensity of 3.0 or greater and an SP value of 12 to 18 (cal/cm.sup.3).sup.1/2, a magenta ink M1 which has a fluorescent brightening intensity of 3.0 or greater and an SP value of 12 to 18 (cal/cm.sup.3).sup.1/2, a yellow ink Y1 which has a fluorescent brightening intensity of 3.0 or greater and an SP value of 12 to 18 (cal/cm.sup.3).sup.1/2, a cyan ink C2 which has a fluorescent brightening intensity of less than 3.0 and an SP value of 12 to 18 (cal/cm.sup.3).sup.1/2, a magenta ink M2 which has a fluorescent brightening intensity of less than 3.0 and an SP value of 12 to 18 (cal/cm.sup.3).sup.1/2, and a yellow ink Y2 which has a fluorescent brightening intensity of less than 3.0 and an SP value of 12 to 18 (cal/cm.sup.3).sup.1/2, in which the SP values are values obtained by a turbidity titration method using a mixed solution of water and acetone.

The head chip includes an actuator plate having ejection channels and non-ejection channels extending in a Y direction and arranged alternately in an X direction, an intermediate plate overlapped with the actuator plate in a Z direction, and provided with communication holes communicated with the ejection channels and through holes communicated with the non-ejection channels, and a nozzle plate overlapped with the intermediate plate in the Z direction in a state of closing the through holes, and provided with nozzle holes which are communicated with the communication holes, jet liquid contained in the ejection channels, and are formed at positions corresponding to the ejection channels. The non-ejection channels are communicated with an outside of the head chip. The through holes are each disposed at an inner side in the X direction of the inner surfaces extending in the Y direction of the non-ejection channel viewed from the Z direction.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.