A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

A thermal head includes a substrate, a glaze layer, and a reinforced conductor layer. The glaze includes a first glaze and a second glaze. The first glaze extends in a predetermined direction on the surface of the substrate. The second glaze is spaced part from the first glaze to one side in a direction perpendicular to the predetermined direction on the surface of the substrate. The reinforced conductor layer includes a lateral side part. The lateral side part extends on the surface of the substrate from the first glaze side to the second glaze side and is partially located on the second glaze. An edge part on the first glaze side in the second glaze includes a cutout portion cut out toward the one side in the direction perpendicular to the predetermined direction. The lateral side part passes through the cutout portion.

On an element substrate having a multilayered structure in which a temperature detection element is provided in an intermediate layer of a wiring layer and a print element layer, a wiring layer and a temperature detection element formed on the first interlayer insulation film are connected by a first conductive plug which penetrates through the first interlayer insulation film. In addition, a wiring layer and a print element which are formed on the second interlayer insulation film formed on the first interlayer insulation film are connected by a second conductive plug which penetrates through the first and second interlayer insulation films. By manufacturing the element substrate by this arrangement, the thickness of an interlayer insulation film between a print element and a temperature detection element can be made thin, and the sensitivity of the temperature detection element can be improved.

Embodiments of the present invention describe a thermal print head (TPH) that is easily replaced in a slot on the side of a thermal printing device using a push/eject mechanism. Other embodiments of the present invention describe a thermal printing device where the print pressure is easily adjusted for different types of printing media (labels) by turning a turnknob. In preferred embodiments, the turnknob has three print pressure settings, high, medium, and low.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

On an element substrate having a multilayered structure in which a temperature detection element is provided in an intermediate layer of a wiring layer and a print element layer, a wiring layer and a temperature detection element formed on the first interlayer insulation film are connected by a first conductive plug which penetrates through the first interlayer insulation film. In addition, a wiring layer and a print element which are formed on the second interlayer insulation film formed on the first interlayer insulation film are connected by a second conductive plug which penetrates through the first and second interlayer insulation films. By manufacturing the element substrate by this arrangement, the thickness of an interlayer insulation film between a print element and a temperature detection element can be made thin, and the sensitivity of the temperature detection element can be improved.

A thermal head includes a substrate, a glaze layer, and a reinforced conductor layer. The glaze includes a first glaze and a second glaze. The first glaze extends in a predetermined direction on the surface of the substrate. The second glaze is spaced part from the first glaze to one side in a direction perpendicular to the predetermined direction on the surface of the substrate. The reinforced conductor layer includes a lateral side part. The lateral side part extends on the surface of the substrate from the first glaze side to the second glaze side and is partially located on the second glaze. An edge part on the first glaze side in the second glaze includes a cutout portion cut out toward the one side in the direction perpendicular to the predetermined direction. The lateral side part passes through the cutout portion.

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode electrically connected to the heat generating section; a cover layer which covers part of the electrode; a pad electrically connected to the electrode; and a joining member electrically connected to the pad. The cover layer includes a first portion and a second portion which is smaller in thickness than the first portion. The second portion is placed on the pad. The pad has a convexity which exposes from the second portion. The joining member is connected to the convexity.

A thermal head includes a substrate; a plurality of heat generating portions; a common electrode disposed on the substrate and electrically connected to the plurality of heat generating portions; a plurality of individual electrodes disposed on the substrate and each electrically connected to a corresponding one of the plurality of heat generating portions; a first insulation layer disposed on the heat generating portions, a part of the common electrode, and a part of the individual electrodes; a second insulation layer located adjacent to the first insulation layer and disposed on a part of the individual electrodes; and a static removing layer disposed on the first insulation layer and grounded. The static removing layer includes a first portion disposed on an upper surface of the first insulation layer and a second portion electrically connected to the first portion and disposed on an upper surface of the second insulation layer.

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.