A method for manufacturing a micromechanical structure in the structural layer of a wafer by forming a first gap and a second gap depositing and patterning a first etching mask and a second etching mask on a horizontal face of the structural layer, etching trenches through the structural layer in the first and second unprotected areas which are not protected by the first etching mask or the second etching mask, coating at least the sidewalls of the trenches with a protective layer and removing the second etching mask at least from a second opening in the first etching mask, so that a temporarily protected area is exposed, and etching away the structural layer in the exposed temporarily protected area.

An etching method of the invention includes: a resist pattern-forming step of forming a resist layer on a target object, the resist layer being formed of a resin, the resist layer having a resist pattern; an etching step of etching the target object via the resist layer having the resist pattern; and a resist protective film-forming step of forming a resist protective film on the resist layer. The etching step is repetitively carried out multiple times. After the etching steps are repetitively carried out multiple times, the resist protective film-forming step is carried out.

The present disclosure relates to an optical scanner package comprising a scanner element, a lower substrate having an inner space, and a semi-spherical transmissive window. The semi-spherical transmissive window has different inclinations in an incident position thereof and in an emission position thereof, and interference caused by sub-reflection can thus be reduced. Since the incident angle α and the maximum emission angle β are small, anti-reflection coating design is easy, and light loss can be reduced. There is an advantage in that, even when the optical scanning angle (OSA) γ of a laser is large, the maximum emission angle β is small, and emitted laser light thus has a small change in characteristics. In addition, since there are curvatures on both sides of two axes, there is little restriction regarding the incident direction even in the case of two-axis driving.

The present disclosure relates to an apparatus, system, and method for a microelectromechanical (MEM) device formed on a transparent, insulating substrate. The MEM device may take the form of an electrostatic comb actuator. The fabrication process employs three-dimensional structuring of the substrate to form the actuator combs, biasing elements, and linkages. The combs and other elements of the actuator may be rendered electrically conducting by a conformal conductive coating. The conductive coating may be segmented into a plurality of electrodes without the use of standard lithography techniques. A linear-rotational actuator is provided, which may comprise two perpendicularly-arranged, linear actuators that utilize moveable linkage beams in two orthogonal dimensions. A linear or torsional ratcheting actuator is also provided by using comb actuators in conjunction with a ratcheting wheel or cog. Furthermore, several methods for electrically connecting non-contiguous or enclosed elements are provided.

A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that includes a first lateral etch stop that includes a first corner radius and a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.

A micromechanical switch including a first substrate with a micromechanical functional layer in which a deflectable switching element is formed, and with a second substrate that is connected to the first substrate. The second substrate is situated at a distance above the switching element. The switching element includes an electrically conductive first contact area and is deflectable toward the second substrate. The second substrate, at an internal side, includes an electrically conductive second contact area that is situated in such a way that the switching element together with the first contact area may be applied to the second contact area in order to close an electrical contact. A method for manufacturing a micromechanical switch is also described.

Microfluidic devices having superhydrophilic bi-porous interfaces are provided, along with their methods of formation. The device can include a substrate defining a microchannel formed between a pair of side walls and a bottom surface and a plurality of nanowires extending from each of the side walls and the bottom surface. For example, the nanowires can be silicon nanowires (e.g., pure silicon, silicon oxide, silicon carbide, etc., or mixtures thereof).

An electrooptical device includes a first metal layer disposed spaced apart from a first surface of a substrate and including a mirror, which modulates light, and a mirror support post, which has a tubular shape and protrudes from the mirror toward the substrate. The first metal layer is formed by forming a metal layer on a surface of a sacrificial layer having an opening, patterning the metal layer, and removing the sacrificial layer. Thus, the mirror support post is formed so as to extend over the inner wall of the opening. Here, the mirror support post has a thickness of not less than 1.5 times the length of the mirror support post.

A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

An integrated package comprising a lab-on-chip (LOC) is disclosed. The LOC includes at least one integrated device having a membrane portion having a membrane opening; the membrane portion having a first side and a second side, the first side opposite the second side, a MEMS portion disposed on the first side of the membrane portion, the MEMS portion having a sharp member disposed on an actuator stage within a MEMS cavity, and a fluidic portion disposed on the second side of the membrane portion, the fluidic portion having a fluidic cavity for flowing a fluid medium within the fluidic portion; and a fluidic cap forming a surface of the fluidic portion of the LOC, the fluidic cap having a fluidic inlet and a fluidic outlet. The method of operating the LOC includes power to the at least one integrated device to capture one or more particles for interrogation.