A conductive laminate includes a first organic film, a fine metal wire arranged on the first organic film, and a second organic film arranged to cover the fine metal wire, in which the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of the first organic film, and moisture contents of the first organic film and the second organic film are less than 3.00%.

A window structure includes a metal layer that transmits microwave signals and reflects infrared signals. A microwave signal is a signal that has a frequency in the microwave spectrum of frequencies (a.k.a. the microwave frequency spectrum). The microwave frequency spectrum extends from 300 megahertz (MHz) to 300 gigahertz (GHz). An infrared signal is a signal that has a frequency in the infrared spectrum of frequencies (a.k.a. the infrared frequency spectrum, which extends from 300 GHz to 430 terahertz (THz)). The metal layer may be a discontinuous metal layer that's an electrically discontinuous metal layer and/or a physically discontinuous metal layer.

An improved glazing unit including a glass panel which is low in reflectance for RF radiation, a coating system which is high in reflectance for RF radiation disposed on the glass panel and creating onto the glazing unit a dual band bandpass filter. The glazing unit further includes at least one frequencies selective decoated portion of the coating system extending along a plane, P; having a width, DW, and a length, DL. The at least one frequencies selective decoated portion features a first decoated element with a plurality of unit cells, and a plurality of second decoated elements where a second decoated element is placed in a unit cell of the first decoated element, but no second decoated element is in contact with the first decoated element and at least one unit cell of the first decoated element has no second decoated element.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

Articles and methods regarding composite conductor materials comprising a first conductive material layer and a first carbonaceous material layer. In certain embodiments, the first carbonaceous material layer comprises an sp2 hybridized carbon compound. In certain embodiments, the electrical conductivity of the composite conductive material can be controlled and exhibits a conductivity at least 1.5% greater than the conductivity of the first conductive material layer alone.

A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200° C. and less than or equal to 300° C., and the second temperature is greater than or equal to 350° C. and less than or equal to 450° C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0° C./min and less than 8.7° C./min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

A method of manufacturing a glass article comprising: forming a first layer of a first metal on a glass substrate, the glass substrate comprising silicon dioxide and aluminum oxide; subjecting the glass substrate with the first layer of the first metal to a first thermal treatment; forming a second layer of a second metal over the first layer of the first metal; and subjecting the second layer of the second metal to a second thermal treatment, the first thermal treatment and the second thermal treatment inducing intermixing of the first metal, the second metal, and at least one of aluminum, aluminum oxide, silicon, and silicon dioxide of the glass substrate to form a metallic region comprising the first metal, the second metal, aluminum oxide, and silicon dioxide. The first metal can be silver. The second metal can be copper.

The invention relates to a method for depositing metal particles on a textile support, which comprises: placing at least one textile sheet (1) made of side-emitting optical fibers (2) in contact with a solution containing at least one ionic precursor of a metal to be deposited, the textile sheet (1) being formed from optical fibers (2) woven in warp and/or weft with binding threads in warp and/or weft, each of the optical fibers (2) having invasive alterations (5) along the fiber and allowing the emission of light propagating in the fiber at these alterations (5), the textile sheet (1) being coated on all or part of the surfaces thereof with a layer of semiconductor particles (4) having photocatalytic properties, the textile sheet (1) and the solution being contained in a space of a reactor (9), the space being free of oxygen; illuminating the textile sheet (1) by at least one light source (7) connected to all or part of the free ends (6) of the optical fibers (2), the light source generating light radiation suitable for activating the photocatalysis of the semiconductor inducing the deposition of metal particles on the photocatalytic layer (4).

A method of depositing a copper film on a major surface of a glass sheet includes determining a desired range of a property of the copper film, correlating a thermal history of the glass sheet to the desired range of the property of the copper film, and depositing the copper film on the major surface of the glass sheet, wherein the property of the copper film deposited on the glass sheet is within the desired range. Correlating the thermal history of the glass sheet to the desired range of the property of the copper film can include heat treating glass sheet prior to depositing the copper film on the glass sheet.