Patent classifications
C08F220/20
Resist composition and patterning process
A chemically-amplified negative resist composition includes: (A) a quencher containing an onium salt shown by the following formula (A-1); (B) a base polymer containing repeating units shown by the following formulae (B1) and (B2); and (C) a photo-acid generator which generates an acid. Thus, the present invention provides: a negative resist composition which can form a favorable profile with high sensitivity and low LWR and CDU in a pattern; and a resist patterning process using the composition. ##STR00001##
High refractive index, high Abbe number intraocular lens materials
Disclosed are high refractive index, hydrophobic, acrylic materials. These materials have both high refractive index and a high Abbe number. This combination means the materials have a low refractive index dispersion and thus are especially suitable for use as intraocular lens materials. The materials are also suitable for use in other implantable ophthalmic devices, such as keratoprostheses, corneal rings, corneal implants, and corneal inlays.
Photocurable resin composition
A photocurable resin composition which can improve adhesion between light transmitting members. The photocurable resin composition contains a monofunctional acrylic monomer having a heating residue of 85.0% or less after being heated at 60° C. for 30 minutes, a crosslinking agent, a photopolymerization initiator, and a softening agent composed of at least one of plasticizer and tackifier, and the heating residue after being heated at 60° C. for 30 minutes is less than 96.0%.
Photocurable resin composition
A photocurable resin composition which can improve adhesion between light transmitting members. The photocurable resin composition contains a monofunctional acrylic monomer having a heating residue of 85.0% or less after being heated at 60° C. for 30 minutes, a crosslinking agent, a photopolymerization initiator, and a softening agent composed of at least one of plasticizer and tackifier, and the heating residue after being heated at 60° C. for 30 minutes is less than 96.0%.
Curable compositions for pressure-sensitive adhesives
Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.
Curable compositions for pressure-sensitive adhesives
Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.
Curable compositions for pressure-sensitive adhesives
Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.
FLAME, SMOKE AND TOXICITY RETARDANT COMPOSITION FOR USE IN POLYURETHANE/POLYISOCYANURATE COMPRISING FOAMS
A reactive mixture comprising a Fire, Smoke and Toxicity retardant (FST) composition for making a polyisocyanurate and/or polyurethane (PIR/PUR) comprising material, said FST composition comprising: a) at least one compound having at least one ethylenically unsaturated moiety having a number average equivalent weight<160 g/mol, and b) optionally one or more radical initiator compound characterized in that the onset temperature for radical polymerization (T.sub.onset) of the ethylenically unsaturated compound with or without the radical initiator is 2° C. up to 40° C. lower than the maximum reaction temperature achieved during the process for making the PIR/PUR material (reaction exotherm (T.sub.reaction)).
FLAME, SMOKE AND TOXICITY RETARDANT COMPOSITION FOR USE IN POLYURETHANE/POLYISOCYANURATE COMPRISING FOAMS
A reactive mixture comprising a Fire, Smoke and Toxicity retardant (FST) composition for making a polyisocyanurate and/or polyurethane (PIR/PUR) comprising material, said FST composition comprising: a) at least one compound having at least one ethylenically unsaturated moiety having a number average equivalent weight<160 g/mol, and b) optionally one or more radical initiator compound characterized in that the onset temperature for radical polymerization (T.sub.onset) of the ethylenically unsaturated compound with or without the radical initiator is 2° C. up to 40° C. lower than the maximum reaction temperature achieved during the process for making the PIR/PUR material (reaction exotherm (T.sub.reaction)).
ADHESIVE AGENT, ADHESIVE TAPE, ELECTRICAL APPLIANCE, ONBOARD MEMBER, AND SECURING METHOD
A pressure-sensitive adhesive comprising a polymer (X1) containing 48% by mass or more of a constituent unit derived from at least one monomer (Y) selected from the group consisting of a monomer (A1) represented by the following general formula (1) and a monomer (B1) represented by the following general formula (2), in which a tan δ (23° C.) determined as G″ (23° C.)/G′ (23° C.) is 0.8 to 1.3, wherein a storage elastic modulus and a loss coefficient at 23° C. are respectively represented by G′ (23° C.) and G″ (23° C.). In the formula (1), R.sup.1 represents H or CH.sub.3, R.sup.2 represents —C.sub.nH.sub.2n+1 and n represents an integer of 7 to 14. In the formula (2), R.sup.3 represents —C(═O)C.sub.mH.sub.2m+1 and m represents an integer of 7 to 13. Thus, retention force under high temperature, low-temperature attachability, and adhesiveness to a low-polar adherend are favorable along with a high bio rate.