An anaerobically curable composition comprising: a liquid anaerobically curable component; a solid anaerobically curable component; a solid thermoplastic polyurethane resin having a molecular weight in the range of from 40,000 g/mol to 100,000 g/mol and a melting point in the range of from 40° C. to 80° C.; and a curing component for curing the anaerobically curable components.

Advantageously, the compositions of the invention are substantially solid and may be used as threadlockers.

Provided are: a negative photosensitive resin composition with which high resolution properties are exhibited when a relief pattern is formed on copper wiring, imidization adequately progresses even when the curing temperature is low, and a cured relief pattern having good adhesion to copper wiring can be manufactured; and a method for manufacturing a cured relief pattern using the negative photosensitive resin composition. This negative photosensitive resin composition contains (A) a polyimide precursor including specific structural units which are represented by general formula (1) and which have a univalent organic group having a urea structure, and (B) a photopolymerization initiator.

A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.

Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Provided is a photochromic curable composition which forms a cured body that develops excellent photochromic properties. The photochromic curable composition (A) includes: a polyrotaxane monomer wherein, in a polyrotaxane compound having a composite molecular structure composed of an axial molecule and a plurality of cyclic molecules threaded onto the axial molecule, and side chains having OH groups introduced into the cyclic molecules, 1 mol % or more to less than 100 mol % of OH groups in the side chains are modified with a compound having a radical-polymerizable group, (B) a photochromic compound, and (C) a polymerizable monomer other than the (A) polyrotaxane monomer.

Provided is a photochromic curable composition which forms a cured body that develops excellent photochromic properties. The photochromic curable composition (A) includes: a polyrotaxane monomer wherein, in a polyrotaxane compound having a composite molecular structure composed of an axial molecule and a plurality of cyclic molecules threaded onto the axial molecule, and side chains having OH groups introduced into the cyclic molecules, 1 mol % or more to less than 100 mol % of OH groups in the side chains are modified with a compound having a radical-polymerizable group, (B) a photochromic compound, and (C) a polymerizable monomer other than the (A) polyrotaxane monomer.

A silicone copolymer represented by formula (1) or (2) and as defined herein:

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A silicone copolymer represented by formula (1) or (2) and as defined herein:

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Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).