This invention relates to polymers made from low molecular weight polyamide oligomers and telechelic polyamides (including copolymers) containing N-alkylated amide groups in the backbone structure. The described telechelic polyamides are used as the soft segment in the described TPU. These telechelic polyamides are unique in that they have an unexpectedly low glass-transition (desirably 30 degrees C. or lower) which makes them suitable for further reaction and polymerization, allowing for the formation of the described TPU. The resulting TPU can provide improved hydrolytic, oxidative and/or thermal stability as well as improved adhesion to other materials, especially polar materials.

Polymers are disclosed that incorporate portions of secondary or tertiary polyamide segments connected with polyisocyanates. These polymers have enhanced matting properties. The enhanced matting properties are from creating an inherently matt surface from the polymer without the use of any separate fine particle size matting additives. Conventional matting agents such as fine particle size silica usually results in loss of physical properties such as haze development and porosity in the coating from the matting agent. Composites and hybrids of these polymers and other polyamides, polyurethane with vinyl polymers (acrylates) are also disclosed and claimed.

A moisture-sensed shrinking ink applied to a digital printing process for fabric has a viscosity between 2.5 cP and 10.0 cP and a surface tension between 22 dyne/cm and 32 dyne/cm, in which the moisture-sensed shrinking ink includes 15 parts by weight to 35 parts by weight of a moisture-sensed shrinking resin and 65 parts by weight to 85 parts by weight of water.

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

A polyaspartate composition is provided which comprises a reaction product of a diamine and a diester reacted at a ratio of diamine equivalents to diester equivalents of from 1:0.95 to 1:0.50. The polyaspartate compositions of the invention may be combined with polyisocyanates to produce polyurea compositions, e.g., coatings, adhesives, sealants, composites, castings, and films, which exhibit a faster cure time along with faster development time for physical properties such as hardness and tensile strength.

In one or more embodiments, the present invention provides a novel approach to the addition of plasticizers for softening TPUs, i.e., lowering the durometer and the melt viscosity. This approach involves incorporating bonded sulfonate groups with quaternary ammonium counterions into the TPU. In one or more embodiments of the present invention, the softening of TPU is achieved by incorporating an ionic diol, such as N,N-bis (2-hydroxyethyl)-2-aminoethane-sulfonic acid (BES), coupled with various bulky alkyl ammonium cations, during the chain extension step of the TPU synthesis. It is believed that that steric hindrance of the bulky quaternary ammonium groups weakens the dipole-dipole interactions of the sulfonate groups and/or lowers the crystallinity of the hard block, thereby creating additional free volume that softens the polymer and lowers the melt viscosity.

Provided is a foamable polyamide composition comprising a) at least one polyamide comprising at least one carboxylic group; b) at least one thermoplastic rubber; and c) at least one compound having at least one isocyanate group; and optionally d) at least one filler and e) at least one additive.

Provided is an adhesive comprising a reaction product of (A) an aliphatic polyisocyanate having a molecular weight of from 132 to 700; and (B) a polyaspartate comprising a reaction product of (B1) a polyamine having a molecular weight of at least 240, and (B2) a Michael addition receptor, wherein viscosity @ 23° C. according to ASTM D1084-16, remains below 150 cps after four hours, and wherein the adhesive develops an acceptable bond strength to a substrate, defined as having a minimum of 150 g/in. measured @ 23° C. according to ASTM D 1876-01 or substrate tear, in less than five days after the substrate is laminated with the adhesive. The inventive flexible packaging adhesives are free of aromatic amines and may find use in multilayer laminates for a variety of industries, including the food processing, cosmetics, and detergents industries.

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

A polyaspartate composition is provided which comprises a reaction product of a diamine and a diester reacted at a ratio of diamine equivalents to diester equivalents of from 1:0.95 to 1:0.50. The polyaspartate compositions of the invention may be combined with polyisocyanates to produce polyurea compositions, e.g., coatings, adhesives, sealants, composites, castings, and films, which exhibit a faster cure time along with faster development time for physical properties such as hardness and tensile strength.