Provided is an aromatic polycarbonate resin composition, including, with respect to 100 parts by mass of an aromatic polycarbonate resin (A), 0.01 part by mass to 0.1 part by mass of an alicyclic epoxy compound (B), 0.2 part by mass to 0.6 part by mass of a polyether compound (C) having a polyoxyalkylene structure, and 0.005 part by mass to 1 part by mass of a phosphorus-based compound (D), wherein a difference between a YI value of a 5-millimeter thick molded body, which is obtained by molding the aromatic polycarbonate resin composition at 320° C., after a lapse of 3,000 hours under an environment at 85° C. and a humidity of 85%, and an initial YI value thereof is 3.0 or less.

Provided is a curable resin composition which can be molded by casting to obtain composite materials each composed of a polycarbonate resin and an acrylic resin and having high transparency and high impact strength. More specifically, provided is a curing resin composition comprising an acrylic monomer having a saturated group, a polycarbonate resin having an unsaturated-group-containing terminal structure at a molecular end, and a free-radical polymerization initiator.

Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group).

##STR00001##

Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group).

##STR00001##

In various aspects, the disclosure relates to polycarbonate compositions exhibiting improved impact strength, both multi axial and notched Izod, as well as thin-walled flame resistance while free or substantially free of bromine or chlorine flame retardant additives. The polycarbonate compositions may comprise non-bonding glass fiber, butyl tosylate, and/or a phosphorous based stabilizer.

In various aspects, the disclosure relates to polycarbonate compositions exhibiting improved impact strength, both multi axial and notched Izod, as well as thin-walled flame resistance while free or substantially free of bromine or chlorine flame retardant additives. The polycarbonate compositions may comprise non-bonding glass fiber, butyl tosylate, and/or a phosphorous based stabilizer.

Provided is a resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher, having low loss tangent, and, an electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher. The resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher contains a polycarbonate resin, and the polycarbonate resin having a mass ratio of a structural unit represented by formula (1) and a carbonate unit other than the structural unit represented by formula (1) of (33 to 100):(67 to 0), in formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group.

##STR00001##

Provided is a resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher, having low loss tangent, and, an electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher. The resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher contains a polycarbonate resin, and the polycarbonate resin having a mass ratio of a structural unit represented by formula (1) and a carbonate unit other than the structural unit represented by formula (1) of (33 to 100):(67 to 0), in formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group.

##STR00001##

A sheet formed from a carbon fiber reinforced thermoplastic resin with a simplified production process and excellent mechanical characteristics, and a production method of said sheet is provided. This sheet is formed from a carbon fiber reinforced thermoplastic resin that contains carbon fibers, dichloromethane, and a thermoplastic resin containing at least one of a polycarbonate resin and a polyarylate resin, and the content of the dichloromethane contained in the sheet is 10-10,000 ppm by mass.

In various aspects, the disclosure relates to polycarbonate compositions exhibiting improved impact strength, both multi axial and notched Izod, as well as thin-walled flame resistance while free or substantially free of bromine or chlorine flame retardant additives. The polycarbonate compositions may comprise non-bonding glass fiber, butyl tosylate, and/or a phosphorous based stabilizer.