Described herein is a polyamide composition [composition (C)] including: from 0 to 30% wt of at least one polyamide [polyamide (A)]; and from above 30 to 99.99% wt of at least one branched polyamide different from polyamide (A).

Described herein is a polyamide composition [composition (C)] including: from 0 to 30% wt of at least one polyamide [polyamide (A)]; and from above 30 to 99.99% wt of at least one branched polyamide different from polyamide (A).

The invention relates to a method (100) for establishing a connection between an inlay (1, 1′, 1″) and a polymer (3) at least partially surrounding the inlay, wherein a monomer (2) is brought into contact (110) with the inlay (1, 1′, 1″) and is subsequently polymerized (120) to form the polymer (3), wherein the temperature TE of the inlay (1, 1′, 1″) is increased (130) at least briefly at least to that temperature TM that the monomer (2) assumes at its maximum during its exothermic polymerization (120) to form the polymer (3), and/or that ensures that the heat flow always runs from the inlay (1, 1′, 1″) to the monomer (2). The invention also relates to a method (200), (300), (400) for the sealing integration of an inlay (1, 1′, 1″) in a component (5). The invention also relates to a device (50) for carrying out the method (100), comprising a conveyor (51) for a lead frame (11) in which a multiplicity of inlays (1, 1′, 1″) are able to be fed, and an at least two-part (52a, 52b) mould (52) which is closable about an individual inlay (1, 1′, 1″) and has a feed (53) for feeding the monomer (2) into the space (54) between the mould (52) and the inlay (1, 1′, 1″), wherein a current supply (55) is provided for the resistive and/or inductive heating (131) of the inlay (1, 1′, 1″) surrounded by the mould (52).

An end capped condensation polymer may be formed by heating a condensation polymer in the presence of an end capping compound to form cleaved condensation polymer reacting at least a portion of the cleaved condensation polymer with the end capping compound to form the end capped condensation polymer. The end capped condensation polymers may be used to form additive manufactured articles having high solids loading and improved processing due to improved rheological behavior.

Copolymers of condensation polymers are formed by a method of cleaving and reacting with a chain extender to form an end capped cleaved condensation polymer that is further reacted with a second compound that may be comprised of a further chain extender and condensation polymer that react with a reactive group still remaining in the chain extender capping the cleaved condensation polymer. The method allows the formation of block copolymers, branched copolymers and star polymers of differing condensation polymers bonded through the residue of a chain extender.

A method of synthesizing polyamide microparticles may comprise: dehydrating and shearing a mixture comprising a matrix fluid, an emulsion stabilizer at about 0.01 wt % to about 50 wt % based on the weight of the matrix fluid, a solvent at about 13 wt % to about 75 wt % based on the weight of the matrix fluid, and a cyclic amide monomer at about 20 wt % to about 90 wt % based on the weight of the matrix fluid to yield an emulsion having a water content of about 1 wt % or less based on the total weight of the emulsion; adding a deprotonating agent to the emulsion at a concentration of about 0.01 wt % to about 1 wt % based on the weight of the matrix fluid; and contacting the emulsion with a polymerization initiator under conditions effective to polymerize the cyclic amide monomer into a plurality of polyamide microparticles.

The present invention includes the efficient dispersion and high loading of fillers in a thermoplastic polymer matrix. In a first general embodiment, the present invention includes a method wherein fillers are first synthesized and dispersed in a liquid monomer. The liquid monomer is then polymerized to a solid. The nanofillers may be silver nanoparticle/nanowire fillers. Ethylene glycol may serve as a solvent, reducing agent as well as precursor monomer for polymerization. In a second general embodiment, the present invention includes a method wherein fillers may be separately synthesized (or obtained commercially) and then added and dispersed in a liquid monomer. The liquid monomer is then polymerized to a solid. In a third general embodiment, a composite is synthesized using interfacial polycondensation. This is accomplished by aggressive mixing of two solvents during the reaction. The aggressive mixing forms microdroplets (i.e., emulsion) and hence dramatically increases the interface area thereby to a much faster polymerization rate.

The present invention includes the efficient dispersion and high loading of fillers in a thermoplastic polymer matrix. In a first general embodiment, the present invention includes a method wherein fillers are first synthesized and dispersed in a liquid monomer. The liquid monomer is then polymerized to a solid. The nanofillers may be silver nanoparticle/nanowire fillers. Ethylene glycol may serve as a solvent, reducing agent as well as precursor monomer for polymerization. In a second general embodiment, the present invention includes a method wherein fillers may be separately synthesized (or obtained commercially) and then added and dispersed in a liquid monomer. The liquid monomer is then polymerized to a solid. In a third general embodiment, a composite is synthesized using interfacial polycondensation. This is accomplished by aggressive mixing of two solvents during the reaction. The aggressive mixing forms microdroplets (i.e., emulsion) and hence dramatically increases the interface area thereby to a much faster polymerization rate.

A method produces polyamide fine particles by polymerizing a polyamide monomer (A) in the presence of a polymer (B) at a temperature equal to or higher than the crystallization temperature of a polyamide to be obtained, wherein the polyamide monomer (A) and the polymer (B) are homogeneously dissolved at the start of polymerization, and polyamide fine particles are precipitated after the polymerization. Polyamide fine particles have a number average particle size of 0.1 to 100 μm, a sphericity of 90 or more, a particle size distribution index of 3.0 or less, a linseed oil absorption of 100 mL/100 g or less, and a crystallization temperature of 150° C. or more.

The present invention relates to a method for providing resistance to phenolic yellowing, during storage, transportation and processing of polyamide articles, caused by the presence of phenolic compounds in plastic package materials. The phenolic yellowing resistance is obtained by adding a sulfonated reagent during polymerization of the polyamide and/or during the formation of the polyamide article, like melt-spinning extrusion, and/or during the conversion of the polyamide article by texturizing.