The present invention relates to a process for producing high-purity hydrosilylation products, and also to the products that may be produced by this process and to the use thereof as surfactants.

A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b)  Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d)  Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.

A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b)  Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d)  Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.

The present application relates to a plasma polymer thin film and a method for preparing the same, the plasma polymer thin film prepared using a first precursor material represented by the following Chemical Formula 1:

##STR00001##

(In Chemical Formula 1,

R.sub.1 to R.sub.9 are each independently H or a C.sub.1-C.sub.5 substituted or unsubstituted alkyl group, and when R.sub.1 to R.sub.9 are substituted, the substituent is an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group).

The present application relates to a plasma polymer thin film and a method for preparing the same, the plasma polymer thin film prepared using a first precursor material represented by the following Chemical Formula 1:

##STR00001##

(In Chemical Formula 1,

R.sub.1 to R.sub.9 are each independently H or a C.sub.1-C.sub.5 substituted or unsubstituted alkyl group, and when R.sub.1 to R.sub.9 are substituted, the substituent is an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group).

A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.

A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.

Reactive poly(fluoroalkyl-functional siloxane) oligomers, method of making the same, and compositions comprising the same are shown and described herein. The reactive poly(fluoroalkyl-functional siloxane) oligomers are is derived from a hydrolysable fluoroalkyl-functional silanes. Coating compositions comprising reactive poly(fluoroalkyl-functional siloxane) oligomer(s) may be used to form a coating or a film on a substrate and impart hydrophobic and/or oleophobic properties. The reactive poly(fluoroalkyl-functional siloxane) oligomer are more hydrophobic and oleophobic and show better chemical resistance than the hydrolysable fluoroalkyl-functional silane.

A defoamer or anti-foam formulation and a process for preparing the same. The process includes in a first step, preparing branched organopolysiloxanes (A) by irradiating organopolysiloxanes (X) of the formula (1)

R.sup.1.sub.3-a(R.sup.2O).sub.aSi—[OSiR.sup.3.sub.2].sub.n—OSi(OR.sup.2).sub.aR.sup.1.sub.3-a   (1).

Where with high-energy radiation, the viscosity of the organopolysiloxanes (A) is at least 40% higher than the viscosity of the organopolysiloxanes (X). In a second step, the branched organopolysiloxanes (A) are treated with a filler (B) which is selected from precipitated and/or fumed silicas, and organopolysiloxane resins (C).

A process for end capping and chain extending silanol terminated polydiorganosiloxanes with a mixture of one or more alkylacetoxydialkoxysilanes and one or more alkyldiacetoxyalkoxysilanes. The resulting capped polymeric material may be utilised as a polymer in e.g. a one-part alkoxy sealant composition such as, for example, an alkoxy low modulus clean (non-staining) or clear sealant composition.