Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).

The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

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This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

An element including: a first electrode; an intermediate layer made of a silicone rubber composition containing a silicone rubber; and a second electrode, where the first electrode, the intermediate layer, and the second electrode are disposed in this order, wherein a peak intensity ratio (1095±5 cm.sup.−1/1025±5 cm.sup.−1) of an infrared absorption spectrum of the intermediate layer varies along a vertical direction relative to a surface of the first electrode, and to a surface of the second electrode.

An element including: a first electrode; an intermediate layer made of a silicone rubber composition containing a silicone rubber; and a second electrode, where the first electrode, the intermediate layer, and the second electrode are disposed in this order, wherein a peak intensity ratio (1095±5 cm.sup.−1/1025±5 cm.sup.−1) of an infrared absorption spectrum of the intermediate layer varies along a vertical direction relative to a surface of the first electrode, and to a surface of the second electrode.

Provided is an antifouling composition including a polysilazane-based compound (A) and a both terminal carboxy-modified silicone (B), the content of the component (B) being from 0.01 to 10 parts by mass based on 100 parts by mass of the total amount of the component (A), and the antifouling composition serves as a sheet-like antifouling layer-forming material. The antifouling composition is able to form a sheet-like antifouling layer having favorable surface state and curability and also having excellent water repellency such that even when a tilt angle is small, water droplets can be slipped off.

The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

The present disclosure provides an optical laminate which exhibits improved adhesive strength and scratch resistance together with excellent hardness and fingerprint resistance properties, by further including a fingerprint-resistant layer including an organosilane having excellent adhesion strength with the hard coating layer and an anti-fouling function on the hard coating layer including the transparent support substrate layer and the hard coating layer.