Disclosed are an anti-icing material with stealth function, a preparation method and use thereof. The anti-icing material with stealth function according to the disclosure includes an electrically insulating and thermally insulating layer, a patterned heating layer, an electrically insulating and thermally conducting layer, and a hydrophobic layer, that are disposed sequentially through stacking, wherein the patterned heating layer has a patterned hollowed-out structure.

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.

A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

A color conversion film is provided. The film includes at least one narrow band emission phosphor dispersed within a binder matrix, wherein the narrow band emission phosphor has a D50 particle size from about 0.1 μm to about 15 μm and is selected from the group consisting of a green-emitting U.sup.6+-containing phosphor, a green-emitting Mn.sup.2+-containing phosphor, a red-emitting phosphor based on complex fluoride materials activated by Mn.sup.4+, and a mixture thereof. A device is also provided.

Provided are semiconductor particles including a Group 12-16 semiconductor including a Group 12 element and a Group 16 element, a Group 13-15 semiconductor including a Group 13 element and a Group 15 element, or a Group 14 semiconductor including a Group 14 element, the semiconductor particles having a plasma frequency of 1.7×10.sup.14 rad/s to 4.7×10.sup.14 rad/s and a maximum length of 1 nm to 2,000 nm; and a dispersion, a film, an optical filter, a building member, or a radiant cooling device, in all of which the semiconductor particles are used.

Provided is a binder composition for a non-aqueous secondary battery electrode with which it is possible to form an electrode having excellent electrolyte solution injectability and process adhesiveness. The binder composition for a non-aqueous secondary battery electrode contains a particulate polymer formed by a polymer that includes a block region composed of an aromatic vinyl monomer unit and has a tetrahydrofuran-insoluble content of not less than 5 mass % and not more than 40 mass %. The binder composition for a non-aqueous secondary battery electrode preferably further contains a water-soluble polymer that includes a hydrophilic group and has a weight-average molecular weight of not less than 15,000 and not more than 500,000.

A conductive polymeric composition includes, based on a total weight of the conductive polymeric composition, 0.1 wt % to 10 wt % of carbon nanotubes, 0.2 wt % to 4 wt % of a first component, 0.1 wt % to 4 wt % of a second component made by esterification of a C.sub.16-C.sub.30 fatty acid with a polyol compound, and the balance being a polymeric component. When the first component is a first polymer obtained from polycondensation of an aromatic diacid compound and an aliphatic glycol compound, the polymeric component is a polyester. When the first component is a second polymer obtained from polycondensation of a lactam compound, a diamine compound and a dicarboxylic acid compound, the polymeric component is a polyamide.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

The invention relates to a method of additive manufacturing an object using a 3D printing apparatus, in which at least one layer or part of at least one layer is formed by an addition-crosslinking electro-conductive silicone composition comprising : (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2- C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C comprising at least one metal from the platinum group or the compound thereof, (D) at least one reinforcing silica filler D, (E) at least one thixotropic agent which is selected from compounds having epoxy group, (poly)ether group, and/or (poly)ester group, organopolysiloxane having an aryl group and mixtures thereof; (F) at least one electro-conductive filler F, which is selected from nickel coated carbon, preferably graphite, graphene or mixtures thereof; (G) optionally at least one crosslinking inhibitor G.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.