Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Compositions include a plurality of polymer particulates comprising a matrix polymer and one or more types of nanoparticles selected from the group consisting of biopolymer nanoparticles, biomineral nanoparticles excluding biomineralized silica alone, and any combination thereof. Illustrative examples of such nanoparticles may include cellulose nanoparticles, hydroxyapatite nanoparticles, or any combination thereof associated with the matrix polymer. The polymer particulates may be prepared by melt emulsification. Methods include depositing such polymer particulates in a powder bed; and heating a portion of the powder bed to consolidate a portion of the polymer particulates into a consolidated part having a specified shape. The matrix polymer may be biodegradable and lose at least about 40% mass in six days in a phosphate buffer solution (0.2 M, pH 7.0) containing 0.2 mg/mL of lipase obtained from Pseudomonas cepacia (≥30 U/mg) and incubated at 37° C.

A rubber composition for a tire, which does not require the addition of a compound when synthesizing rubber component and the modification of a rubber component, and a winter tire using the rubber composition are provided. The rubber composition for a tire contains fine particles of rotaxane having a straight chain molecule, acyclic molecule clathrating the straight chain molecule and blocking groups arranged at both terminals of the straight chain molecule such that the cyclic molecule does not desorb from the straight chain molecule, covered with silica; a rubber component comprising styrene-butadiene rubber; and at least one of carbon black and silica, wherein the total content of the fine particles, the carbon black and the silica (excluding silica covering rotaxane) is 70 to 150 parts by mass per 100 parts by mass of the rubber component.

A gear is provided that has excellent continuous moldability for practical use, and both high slidability and high durability. The provided gear is a molded resin constructed of a resin composition comprising a thermoplastic resin (A) and cellulose nanofibers (B) with an average fiber diameter of 1000 nm or smaller, and having a number average molecular weight of the thermoplastic resin (A) in the range of 10,000 to 150,000, wherein a sliding surface of the gear with another gear teeth has an arithmetic mean surface roughness Sa of 3.0 μm or lower.

The invention provides a heavy-duty tire rubber composition excellent in wet grip performance and steering stability, and a tire tread, a bead filler, a tire belt and a heavy-duty tire which each partially include the composition. The heavy-duty tire rubber composition includes 100 parts by mass of a solid rubber (A), 0.1 to 50 parts by mass of a modified liquid diene rubber (B) having a functional group derived from a silane compound with a specific structure, and 20 to 200 parts by mass of a filler (C), the modified liquid diene rubber (B) satisfying the following (i) and (ii): (i) the weight average molecular weight (Mw) is not less than 1,000 and not more than 120,000, and (ii) the vinyl content is not less than 30 mol % and less than 70 mol %.

The invention is directed to a polypropylene composition, to a three-dimensional article comprising said polypropylene composition, and to the use of said composition for automotive articles. The polypropylene composition of the invention comprises: 40-90% by total weight of the composition of a polymer blend comprising polypropylene having a melt flow index as measured according to ISO 1133 at 230° C. and 2.16 kg of 2.0-100 g/10 min; 5-25% by total weight of the composition of one or more plastomers; 0.5-25% by total weight of the composition of mineral filler selected from the group consisting of phyllosilicates, mica or wollastonite; and 0.2-4% by total weight of the composition of glass fibres having an average fibre diameter in the range of 5-30 μm.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

The present invention relates to a road paving method enabling one to provide an asphalt paving material layer in which both excellent stability and stress relaxation can be made compatible with each other, the method including Step 1: a step of mixing asphalt, a thermoplastic elastomer, a polyester, and an aggregate to obtain an asphalt mixture, and Step 2: a step of laying the asphalt mixture obtained in Step 1 on a road, thereby forming an asphalt paving material layer, wherein the polyester has a softening point of 90° C. or higher and 140° C. or lower and a glass transition point of 40° C. or higher and 80° C. or lower, and a ratio of the polyester is more than 17 parts by mass and 50 parts by mass or less based on 100 parts by mass of the asphalt.

Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.

An organic-inorganic hybrid material is disclosure. The organic-inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm.sup.−1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.