Colored coating compositions comprising a polymer binder and a sphere selected from porous metal oxide spheres formed from metal oxide particles and having an average porosity of from 0.10 to 0.90; polymer spheres formed from a multimodal distribution of polymer particles; or mixtures thereof, wherein the colored coating composition when dried, exhibits visible light absorbance at a wavelength range from 400 nm to 800 nm. The sphere has an average particle size diameter of from 1 micron to 5 microns, or from 3 microns to 5 microns and exhibits a structural color which may be angle-dependent or angle-independent.

An inner liner for an elastomeric articles is provided. The inner liner contains platy mineral particles having a mean aspect ratio of less than three, where at least about 30% or more of the platy mineral particles have an aspect ratio of 2 or greater. Furthermore, an inflatable article, such as a tire, that includes an inner liner containing the platy mineral particles, is also provided.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:—particulate additive(s) having a BET specific surface area which is ≥50 m.sup.2/g;—amorphous silica particles;—fumed silica particles; and—untreated fumed silica particles.

A method for the preparation of a labelled polymer is presented. The method comprises mixing polymer precursors with a marker and polymerizing the polymer precursors to form a labelled polymer or, alternatively, mixing a polymer with a marker to form a labelled polymer. The method is characterized in that the marker comprises or consists of particles, which comprise or consist of a metal and/or a semimetal, the marker having at least three atomic species having a different atomic number. A marker and a labelled polymer are also provided. In addition, uses of the marker according to the invention are proposed. The marker according to the invention does not significantly affect the properties of the polymer and allows coded information in a wide variety of polymers to be read out in a simple and rapid manner and over long polymer lifetimes.

A photo-curable resin composition for three-dimensional shaping including: a resin component (A) containing a (meth)acrylate compound (A1) represented by General Formula (1)

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(where R.sub.1 is a hydrogen atom or a methyl group, and R.sub.2 is a linear, branched, or cyclic trivalent hydrocarbon group with one to eight carbon atoms which may have three or less heteroatoms), and a urethane (meth)acrylate compound (A2) having two or more radical-polymerizable functional groups; inorganic particles (B); and a photoradical polymerization initiator (C). 40% by mass or more and 90% by mass or less of the (meth)acrylate compound (A1) is contained in the resin component (A). 10% by mass or more and 60% by mass or less of the urethane (meth)acrylate compound (A2) is contained in the resin component (A).

A quantum dot composite material, and an optical film and a backlight module using the same are provided. The quantum dot composite material includes a curable polymer and a plurality of quantum dots dispersed in the curable polymer. Based on the total weight of the curable polymer being 100%, the curable polymer includes 15 wt % to 40 wt % of monofunctional group acrylic monomer, 15 wt % to 40 wt % of multifunctional group acrylic monomer, 5 wt % to 35 wt % of mercaptan functional group monomer, 1 wt % to 5 wt % of photoinitiator, 10 wt % to 30 wt % of acrylic oligomer, and 5 wt % to 25 wt % of scattering particles.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

A crosslinked adhesive composition comprising: (i) a polymer; (ii) solid particles embedded within the polymer; and (iii) a multiplicity of boronate linkages crosslinking between the polymer and solid particles, wherein the boronate linkages have the formula

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wherein the polymer and particles are connected to each other through the boronate linkages, and the crosslinked adhesive composition has an ability to bond surfaces and a further ability to thermally debond and rebond the surfaces. Also described herein is a method of bonding first and second surfaces together, the method comprising placing the above-described crosslinked adhesive composition onto the first surface and pressing the second surface onto the crosslinked adhesive composition on the first surface.

A nanocomposite includes a plurality of nanoparticles, where each nanoparticle of the plurality of nanoparticles includes a TiO.sub.2 nanoparticle core characterized by a diameter between about 1 nm and about 20 nm and a surface .OH density below about 6.OH/nm.sup.2, and a nanoparticle shell conformally formed on surfaces of the TiO.sub.2 nanoparticle core. The nanoparticle shell is continuous and is thinner than about 2 nm. The nanoparticle shell includes a transparent material with a refractive index greater than about 1.7 for visible light. A valence band of the nanoparticle shell is more than about 0.1 eV lower than a valence band of the TiO.sub.2 nanoparticle core. A conduction band of the nanoparticle shell is more than about 0.5 eV higher than a conduction band of the TiO.sub.2 nanoparticle core.