The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

Compositions for treating a substrate to provide increased lubricity to portions of the substrate surface that come into contact with the surface of a mating component are provided. The treated substrates provide improved lubricity, while maintaining adhesion between the surface of the substrate and an overlying polymer coating and imparting corrosion resistance to the substrate surface. The compositions include a silanol coupling agent in combination with lubricating particles, and an acid, which are dissolved or dispersed in a mixture of organic solvent and water.

Compositions for treating a substrate to provide increased lubricity to portions of the substrate surface that come into contact with the surface of a mating component are provided. The treated substrates provide improved lubricity, while maintaining adhesion between the surface of the substrate and an overlying polymer coating and imparting corrosion resistance to the substrate surface. The compositions include a silanol coupling agent in combination with lubricating particles, and an acid, which are dissolved or dispersed in a mixture of organic solvent and water.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.

A one-part primer composition is provided. The one-part primer composition includes a first epoxy resin that is a liquid under ambient conditions a particulate corrosion inhibitor present in an amount of from 5 wt % to 30 wt % relative to the overall weight of the composition excluding carrier solvents and water, a curative comprising a primary aromatic amine, a silane coupling agent, a carrier solvent; and water homogeneously mixed with the carrier solvent and present in an amount sufficient to hydrolyze the silane coupling agent while preserving solubility of the first epoxy resin and curative in the carrier solvent/water mixture. The corrosion inhibitor is pre-dispersed in a liquid epoxy to break the agglomeration of the inhibitors, mitigate settling of the pigment and improve primer performance.

A color material dispersion liquid including a color material, which is a salt-forming compound of an organic dye with a heteropolyoxometalate, a dispersant and a solvent, wherein the organic dye is at least one organic dye selected from the group consisting of a porphyrin dye, a tetraazaporphyrin dye, a phthalocyanine dye and a squarylium dye, and wherein the heteropolyoxometalate is a heteropolyoxometalate which has an oxidation-reduction potential larger than −0.3 V relative to the silver/silver chloride electrode.

The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.

The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.

Compositions and methods for generating ClO.sub.2 gas are disclosed. A composition that includes a chlorite salt is activated by exposure to ultraviolet light. After an optional storage period, the composition is then exposed to moisture, resulting in the generation of ClO.sub.2 gas. Exemplary compositions include polymers in which the chlorite salt is dispersed. The polymers may be used to form films that can be used to package, e.g., food products, pharmaceutical products, medical devices, and/or laboratory devices. Upon exposure to ultraviolet light and moisture, the packaging releases controlled quantities of ClO.sub.2 gas, which may disinfect and/or deodorize the packaged device or product.