Disclosed is a polyolefin-based resin composition for a vehicle interior material including heat-treated waste coffee grounds. The resin composition includes a polyolefin-based resin, waste coffee grounds including a volatile matter (VM) in an amount less than about 20 wt % of the waste coffee grounds, a modified polypropylene, an inorganic filler, and a thermoplastic elastomer.

The biodegradable resin composition according to the present invention contains an aliphatic polyester biodegradable resin and fibrous basic magnesium sulfate.

The biodegradable resin composition according to the present invention contains an aliphatic polyester biodegradable resin and fibrous basic magnesium sulfate.

A quantum dot composite material, and an optical film and a backlight module using the same are provided. The quantum dot composite material includes a curable polymer and a plurality of quantum dots dispersed in the curable polymer. Based on the total weight of the curable polymer being 100%, the curable polymer includes 15 wt % to 40 wt % of monofunctional group acrylic monomer, 15 wt % to 40 wt % of multifunctional group acrylic monomer, 5 wt % to 35 wt % of mercaptan functional group monomer, 1 wt % to 5 wt % of photoinitiator, 10 wt % to 30 wt % of acrylic oligomer, and 5 wt % to 25 wt % of scattering particles.

A quantum dot composite material, and an optical film and a backlight module using the same are provided. The quantum dot composite material includes a curable polymer and a plurality of quantum dots dispersed in the curable polymer. Based on the total weight of the curable polymer being 100%, the curable polymer includes 15 wt % to 40 wt % of monofunctional group acrylic monomer, 15 wt % to 40 wt % of multifunctional group acrylic monomer, 5 wt % to 35 wt % of mercaptan functional group monomer, 1 wt % to 5 wt % of photoinitiator, 10 wt % to 30 wt % of acrylic oligomer, and 5 wt % to 25 wt % of scattering particles.

Systems, devices, and methods are provided for producing a 3d-printable composite material for large scale printing. A method can include receiving a first component comprising a (meth)acrylic monomer or a (meth)acrylic oligomer, or a combination thereof. The method can include receiving a second component comprising a photoinitiator and a third component comprising a polymerization enhancer. The method can include mixing the first component, second component, and third component with a mixing reactor to form a mixture. The method can include filtering the mixture with a filtration unit and removing a solid residue from the mixture. The method can include curing the filtered mixture with a radiation unit into a gel component and a liquid component. The method can include separating the gel component with a phase separation unit and then milling the gel component. And the method can include mixing the gel component, the photoinitiator, the mineral filler and optionally the recycled previously printed composite material to form the composite material.

Systems, devices, and methods are provided for producing a 3d-printable composite material for large scale printing. A method can include receiving a first component comprising a (meth)acrylic monomer or a (meth)acrylic oligomer, or a combination thereof. The method can include receiving a second component comprising a photoinitiator and a third component comprising a polymerization enhancer. The method can include mixing the first component, second component, and third component with a mixing reactor to form a mixture. The method can include filtering the mixture with a filtration unit and removing a solid residue from the mixture. The method can include curing the filtered mixture with a radiation unit into a gel component and a liquid component. The method can include separating the gel component with a phase separation unit and then milling the gel component. And the method can include mixing the gel component, the photoinitiator, the mineral filler and optionally the recycled previously printed composite material to form the composite material.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Abstract: A container body which comprises a base and a side wall extending from the base, wherein said container body includes a polyester and a polymer YY. wherein said polymer YY is selected from the group comprising cyclic block copolymers (CBC) and cyclic olefin polymers (COP).