Provided are semiconductor particles including a Group 12-16 semiconductor including a Group 12 element and a Group 16 element, a Group 13-15 semiconductor including a Group 13 element and a Group 15 element, or a Group 14 semiconductor including a Group 14 element, the semiconductor particles having a plasma frequency of 1.7×10.sup.14 rad/s to 4.7×10.sup.14 rad/s and a maximum length of 1 nm to 2,000 nm; and a dispersion, a film, an optical filter, a building member, or a radiant cooling device, in all of which the semiconductor particles are used.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Problem: To provide a molded article for laser welding which has excellent visible light transmittance and laser transmittance and in which variation in laser transmittance is suppressed, and an agent for suppressing variation in laser transmittance of a molded article for laser welding.

Solution: A molded article for laser welding comprising a polybutylene terephthalate resin composition containing 100 parts by mass of (A) a polybutylene terephthalate resin, (B) a polycarbonate resin in which the melt viscosity at 300° C. and a shear rate of 1000 sec.sup.−1 is 0.20 kPa.Math.s or greater, and 1 part by mass or greater and 10 parts by mass or less of (C) an epoxy-based compound, the molded article having a thickness at a welded part of 1.3 mm or greater, and an agent for suppressing variation in laser transmittance of a molded article for laser welding, the agent containing an epoxy-based compound.

Problem: To provide a molded article for laser welding which has excellent visible light transmittance and laser transmittance and in which variation in laser transmittance is suppressed, and an agent for suppressing variation in laser transmittance of a molded article for laser welding.

Solution: A molded article for laser welding comprising a polybutylene terephthalate resin composition containing 100 parts by mass of (A) a polybutylene terephthalate resin, (B) a polycarbonate resin in which the melt viscosity at 300° C. and a shear rate of 1000 sec.sup.−1 is 0.20 kPa.Math.s or greater, and 1 part by mass or greater and 10 parts by mass or less of (C) an epoxy-based compound, the molded article having a thickness at a welded part of 1.3 mm or greater, and an agent for suppressing variation in laser transmittance of a molded article for laser welding, the agent containing an epoxy-based compound.

Compositions include a plurality of polymer particulates comprising a matrix polymer and one or more types of nanoparticles selected from the group consisting of biopolymer nanoparticles, biomineral nanoparticles excluding biomineralized silica alone, and any combination thereof. Illustrative examples of such nanoparticles may include cellulose nanoparticles, hydroxyapatite nanoparticles, or any combination thereof associated with the matrix polymer. The polymer particulates may be prepared by melt emulsification. Methods include depositing such polymer particulates in a powder bed; and heating a portion of the powder bed to consolidate a portion of the polymer particulates into a consolidated part having a specified shape. The matrix polymer may be biodegradable and lose at least about 40% mass in six days in a phosphate buffer solution (0.2 M, pH 7.0) containing 0.2 mg/mL of lipase obtained from Pseudomonas cepacia (≥30 U/mg) and incubated at 37° C.

Compositions include a plurality of polymer particulates comprising a matrix polymer and one or more types of nanoparticles selected from the group consisting of biopolymer nanoparticles, biomineral nanoparticles excluding biomineralized silica alone, and any combination thereof. Illustrative examples of such nanoparticles may include cellulose nanoparticles, hydroxyapatite nanoparticles, or any combination thereof associated with the matrix polymer. The polymer particulates may be prepared by melt emulsification. Methods include depositing such polymer particulates in a powder bed; and heating a portion of the powder bed to consolidate a portion of the polymer particulates into a consolidated part having a specified shape. The matrix polymer may be biodegradable and lose at least about 40% mass in six days in a phosphate buffer solution (0.2 M, pH 7.0) containing 0.2 mg/mL of lipase obtained from Pseudomonas cepacia (≥30 U/mg) and incubated at 37° C.

Compositions include a plurality of polymer particulates comprising a matrix polymer and one or more types of nanoparticles selected from the group consisting of biopolymer nanoparticles, biomineral nanoparticles excluding biomineralized silica alone, and any combination thereof. Illustrative examples of such nanoparticles may include cellulose nanoparticles, hydroxyapatite nanoparticles, or any combination thereof associated with the matrix polymer. The polymer particulates may be prepared by melt emulsification. Methods include depositing such polymer particulates in a powder bed; and heating a portion of the powder bed to consolidate a portion of the polymer particulates into a consolidated part having a specified shape. The matrix polymer may be biodegradable and lose at least about 40% mass in six days in a phosphate buffer solution (0.2 M, pH 7.0) containing 0.2 mg/mL of lipase obtained from Pseudomonas cepacia (≥30 U/mg) and incubated at 37° C.

The present invention relates to an intumescent coating composition comprising (a) the reaction product of a tetra-alkoxylorthosilicate or partially condensed oligomer thereof and an epoxy resin containing hydroxyl groups, wherein the alkoxy groups are independently selected from C.sub.1-C.sub.20 alkoxy groups (b) one or more spumifics, and (c) one or more metal oxides and/or hydroxides. The intumescent coating composition provides excellent fire performance and char strength. The invention also relates to substrates coated with the intumescent coating composition, and a method of protecting structures from heat/fire.

Provided are a polyamide resin with a high melting point and a high glass transition temperature, a polyamide resin composition, and a molded article. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units, in which 50 mol % or more of the diamine-derived structural units are structural units derived from p-benzenediethanamine, and 65 mol % or more of the dicarboxylic acid-derived structural units are structural units derived from an aromatic dicarboxylic acid.