A film for laminating glass including: a first surface layer; a second surface layer disposed opposite to the first surface layer; and at least one sound insulating layer disposed between the first surface layer and the second surface layer, wherein the film for laminating glass has a L/F value reduction rate [G_L/F(A,B)] of 0.07/° C. or less at a temperature range of 20 to 35° C.

A film for laminating glass including: a first surface layer; a second surface layer disposed opposite to the first surface layer; and at least one sound insulating layer disposed between the first surface layer and the second surface layer, wherein the film for laminating glass has a L/F value reduction rate [G_L/F(A,B)] of 0.07/° C. or less at a temperature range of 20 to 35° C.

A film for laminating glass including: a first surface layer; a second surface layer disposed opposite to the first surface layer; and at least one sound insulating layer disposed between the first surface layer and the second surface layer, wherein the film for laminating glass has a L/F value reduction rate [G_L/F(A,B)] of 0.07/° C. or less at a temperature range of 20 to 35° C.

The photochromic cyclic compound of the present invention is represented by Formula (1) below:

##STR00001##

in the formula, L is a divalent bridging group and PC is a divalent T-type photochromic basic structural group having a naphthopyran structure, where one end of the bridging group L is bonded to at least the 3-position of the naphthopyran structure.

The photochromic cyclic compound of the present invention is represented by Formula (1) below:

##STR00001##

in the formula, L is a divalent bridging group and PC is a divalent T-type photochromic basic structural group having a naphthopyran structure, where one end of the bridging group L is bonded to at least the 3-position of the naphthopyran structure.

The present invention discloses a resin composition containing an isocyanurate ring-containing urethane (meth)acrylate compound A, an isocyanurate ring-containing tri(meth)acrylate compound B, and a triazine ultraviolet light absorber C, wherein the isocyanurate ring-containing urethane (meth)acrylate compound A contains a compound A-1 having a specific structure, and the isocyanurate ring-containing tri(meth)acrylate compound B contains a compound B-1 having a specific structure.

The present invention discloses a resin composition containing an isocyanurate ring-containing urethane (meth)acrylate compound A, an isocyanurate ring-containing tri(meth)acrylate compound B, and a triazine ultraviolet light absorber C, wherein the isocyanurate ring-containing urethane (meth)acrylate compound A contains a compound A-1 having a specific structure, and the isocyanurate ring-containing tri(meth)acrylate compound B contains a compound B-1 having a specific structure.

Provided is a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and an encapsulating composition that can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into an organic electronic device, thereby securing a lifetime of the organic electronic device, and that can be applied to a top-emitting organic electronic device to prevent physical and chemical damage of organic electronic elements, while having excellent optical properties and processability, and an organic electronic device comprising the same.

A film for laminating glass including: a first surface layer; a second surface layer disposed opposite to the first surface layer; and at least one sound insulating layer disposed between the first surface layer and the second surface layer, wherein the film for laminating glass has a L/F value reduction rate [G_L/F(A,B)] of 0.045/° C. or less at a temperature range of 20 to 35° C.

A film for laminating glass including: a first surface layer; a second surface layer disposed opposite to the first surface layer; and at least one sound insulating layer disposed between the first surface layer and the second surface layer, wherein the film for laminating glass has a L/F value reduction rate [G_L/F(A,B)] of 0.045/° C. or less at a temperature range of 20 to 35° C.