An ink jet recording head that includes a substrate having an ejection orifice for ejecting a liquid and a member provided with a recessed portion for accommodating the substrate, the head including a gap formed between a wall of the recessed portion of the member and the substrate, and a sealing material that seals the gap, in which the sealing material contains a cured product of a composition containing at least a hydrogenated bisphenol A type epoxy resin, a solid basic compound, and polythiol.

A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.

A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.

A phosphorus-containing silane compound has a structure of SiR.sub.1(R.sub.2).sub.n(R.sub.3).sub.3-n, wherein R.sub.1 is a phenyl group, R.sub.2 is a vinyl group, R.sub.3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.

##STR00001##

A phosphorus-containing silane compound has a structure of SiR.sub.1(R.sub.2).sub.n(R.sub.3).sub.3-n, wherein R.sub.1 is a phenyl group, R.sub.2 is a vinyl group, R.sub.3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.

##STR00001##

Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

Embodiments of invention provide a method for producing a hard coat film which has a hard coat that is formed from an active energy ray-curable resin composition on at least one surface of a film base. According to at least one embodiment, the active energy ray-curable resin composition used in this method contains (P) 100 parts by mass of a urethane (meth)acrylate compound, (Q) 0.02-5 parts by mass of organic fine particles having an average particle diameter of 10-300 nm, and (R) 0.0002-2 parts by mass of an acrylic silicone-based leveling agent. The method according to at least one embodiment includes the steps of (1) forming a wet coating film by applying the active energy ray-curable resin composition to the film base, (2) forming a dry coating film by drying the wet coating film, and (3) forming a hard coat film by curing the dry coating film by means of active energy ray irradiation at a temperature of 50-90° C.

The method for producing a thermally conductive sheet according to the present invention comprises: a step (1) of obtaining a liquid composition comprising a curable silicone composition including an alkenyl group-containing organopolysiloxane and a hydrogen organopolysiloxane, a thermally conductive filler, and a volatile compound; a step (2) of sandwiching the liquid composition between two resin sheets at least one of which is a gas-permeable film and pressurizing these to obtain a sheet-shaped formed product; and a step (3) of heating the sheet-shaped formed product to volatilize at least a part of the volatile compound. According to the present invention, it is possible to provide a method for producing a thermally conductive sheet having a good sheet condition and a low thermal resistance value.