The present invention pertains to a method for producing a copolymer of ethylene and an allyl monomer having a polar group represented by general formula (1), or a copolymer of ethylene, an allyl monomer having a polar group represented by general formula (1), and other monomers, wherein the copolymer is produced in the presence of a boron compound having a boron-hydrogen bond or a boron-carbon bond (for example, a compound represented by general formula (2)) by using a metal complex represented by general formula (C1) as a polymerization catalyst (the symbols in the formulas are as described in the description). According to the present invention, a copolymer of ethylene and an allyl monomer can be efficiently produced with high catalytic activity, wherein the copolymer has a polar group and can be used in various applications. ##STR00001##

The present invention pertains to a method for producing a copolymer of ethylene and an allyl monomer having a polar group represented by general formula (1), or a copolymer of ethylene, an allyl monomer having a polar group represented by general formula (1), and other monomers, wherein the copolymer is produced in the presence of a boron compound having a boron-hydrogen bond or a boron-carbon bond (for example, a compound represented by general formula (2)) by using a metal complex represented by general formula (C1) as a polymerization catalyst (the symbols in the formulas are as described in the description). According to the present invention, a copolymer of ethylene and an allyl monomer can be efficiently produced with high catalytic activity, wherein the copolymer has a polar group and can be used in various applications. ##STR00001##

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a polymerization control agent. At least one of the main agent and the initiator further contains a peroxide.

A dielectric polymeric composition comprising a polymeric matrix comprising structural units derived from a polymerizable vinyl monomer; an ionic liquid comprising an organic cation and a balancing anion, wherein the ionic liquid is miscible or partially miscible with the polymerizable vinyl monomer, and wherein the concentration of ionic liquid in dielectric polymeric composition ranges from 0.5 to 30 wt. %; and less than 10 ppm of unreacted polymerizable vinyl monomer, based on the total weight of the composition, wherein an amount of unreacted polymerizable vinyl monomer in the composition is measured via HPLC. The polymeric matrix further comprises structural units derived from a polymerizable co-monomer comprising a functional group that has the ability to form hydrogen bonds within the polymeric matrix. The polymeric matrix further comprises a crosslinking agent, and wherein the polymeric matrix comprises covalent crosslinks between the crosslinking agent and the structural units derived from the polymerizable vinyl monomer.

A dielectric polymeric composition comprising a polymeric matrix comprising structural units derived from a polymerizable vinyl monomer; an ionic liquid comprising an organic cation and a balancing anion, wherein the ionic liquid is miscible or partially miscible with the polymerizable vinyl monomer, and wherein the concentration of ionic liquid in dielectric polymeric composition ranges from 0.5 to 30 wt. %; and less than 10 ppm of unreacted polymerizable vinyl monomer, based on the total weight of the composition, wherein an amount of unreacted polymerizable vinyl monomer in the composition is measured via HPLC. The polymeric matrix further comprises structural units derived from a polymerizable co-monomer comprising a functional group that has the ability to form hydrogen bonds within the polymeric matrix. The polymeric matrix further comprises a crosslinking agent, and wherein the polymeric matrix comprises covalent crosslinks between the crosslinking agent and the structural units derived from the polymerizable vinyl monomer.

Microlaser based dye doped polymeric resonators are provided as well as pharmaceutical formulations containing the microlaser based dye doped polymeric resonators, methods of making thereof, and methods of use thereof for monitoring and/or stimulating electrical activity in a brain of a subject in need thereof. The microlaser based dye doped polymeric resonators can include a particle having a spherical core containing one or more fluorescent dyes dispersed within a polymer matrix, wherein the polymer matrix has an index of refraction of about 1.2 or greater; an outer surface surrounding the spherical core; and a gold nanoparticle, wherein the gold nanoparticle is on the outer surface, is dispersed within the spherical core, or both. The fluorescent dyes can include a voltage sensitive fluorescent dye.

Provided is a semiconductor nanoparticle-containing composition capable of forming a wavelength conversion layer that efficiently converts the wavelength of excitation light and exhibits sufficient luminescence intensity. An aspect of the semiconductor nanoparticle-containing composition of the present invention contains semiconductor nanoparticles (A) and a coloring matter (B) and further contains a polymerizable compound (C), in which the semiconductor nanoparticles (A) have a maximum emission wavelength in the range of 500 to 670 nm over a wavelength range of 300 to 780 nm, and the coloring matter (B) contains at least one selected from coloring matters (B1) to (B5) having specific structures.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.