A polyphosphonate resin composition of the present invention comprises: approximately 100 parts by weight of a polyphosphonate resin comprising a repeating unit represented by chemical formula 1; and approximately 0.01-0.05 parts by weight of a sulfonate compound represented by chemical formula 2. The polyphosphonate resin composition has excellent thermal discoloration resistance, light discoloration resistance, flame retardancy, light transmittance and the like.

One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.

According to various embodiments of the present disclosure, a composition includes about 5 to about 40 parts by weight of a solute copolymer component. The solute component optionally has one T.sub.g or T.sub.m of at least 25° C. The composition further includes about 60 to about 95 parts by weight of a solvent monomer. The solvent monomer component includes (meth)acrylate monomers and a multifunctional acrylate. The sum of the solute copolymer component and the solvent monomer component is 100 parts by weight. The composition further includes about 5 to about 100 parts of a plasticizer, relative to the 100 parts.

An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.

Method for manufacturing oxaphosphaphenantrene oxide acrylate monomers by Phospha-Michael addition to acrylates, which comprises reacting oxaphosphaphenantrene oxide with an α,ω-alkyl diol diacrylate in a molar ratio of 1:1.5 to 1:10 in the presence of a base and a polymerisation inhibitor at temperatures from 70 to 120° C. and unreacted α,ω-alkyl diol diacrylate is separated off, monomers obtainable with the method and their use for manufacturing flame retardant thermoplastic (meth)acrylate polymers and method for manufacturing flame retardant thermoplastic (meth)acrylate polymers with the monomers, polymers obtainable in this way and their use for manufacturing transparent films and panels.

Described herein are wound dressing comprising a silicone hydrogel composition and optionally an antimicrobial agent, and methods of making and use thereof. The silicone hydrogel compositions comprise an actinically-crosslinkable polysiloxane-polyglycerol block copolymer crosslinked with a crosslinker. The actinically-crosslinkable polysiloxane-polyglycerol block copolymer being derived from: a polysiloxane prepolymer comprising a polyglycerol side chain, the polyglycerol side chain comprising an ethylenically unsaturated group covalently linked thereto, wherein the ethylenically unsaturated group is actinically curable.

A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.

An anti-fog material comprising a zwitterionic-doped hydrogel made up of charged monomers, at least a portion of which comprise zwitterionic monomers, uncharged hydrophilic monomers, and at least one crosslinking agent is disclosed. A composition for forming the hydrogel and a transparent, removable article comprising the anti-fog material are also disclosed. The article, which may be in the form of a film or decal, may comprise an active layer attached to a backing layer, the active layer comprising an anti-fog material described herein. A method of making a surface of a substrate resistant to fogging by applying the transparent and removable article thereto is also disclosed.

A polypropylene comprising within a range from 0.1 wt % to 4 wt % ethylene and/or C4 to C12 α-olefin derived units, one or more clarifiers, or both; wherein the polypropylene has a flexural modulus of at least 200 kpsi (0.05 in/min ASTM D790(A)) and an Mz/Mw of at least 4. The polypropylenes may be made by combining propylene and a comonomer with a Ziegler-Natta catalyst and at least two external electron donors, wherein the concentration of the electron donors is within a range from 1 to 100 ppm. The concentration of electron donors may be decreased to control the haze level of the polypropylene, and/or the level of comonomer derived units may be controlled to reduce the haze level of the polypropylene.

To provide an optical film having excellent visibility in the wide angle direction. An optical film including at least one resin selected from the group consisting of a polyimide-based resin and a polyamide-based resin, wherein the optical film satisfies Formula (1):
0≤Ts≤0.35  (1)
wherein Ts represents a scattered light ratio (%) and is defined as Ts=Td/Tt×100, Td and Tt represent a diffuse light transmittance (%) and a total light transmittance (%), measured in accordance with JIS K-7136, respectively.