The invention relates to a light-diffusing material, having a high transmission of UVA light, useful for horticultural lighting. The light-diffusing material has a hiding power of greater than 50% at 350 nm and a transmission of light at 350 nm of at least 30 percent, and preferably at least 50%. Additionally the light-diffusing material also transmits and diffuses at least 50% of light at 300 nm, 465 nm, and at 800 nm. The light-diffusing material is especially useful as a glazing for horticultural use.

The invention relates to a light-diffusing material, having a high transmission of UVA light, useful for horticultural lighting. The light-diffusing material has a hiding power of greater than 50% at 350 nm and a transmission of light at 350 nm of at least 30 percent, and preferably at least 50%. Additionally the light-diffusing material also transmits and diffuses at least 50% of light at 300 nm, 465 nm, and at 800 nm. The light-diffusing material is especially useful as a glazing for horticultural use.

The present invention relates to a composition for a gel cushion and to a gel cushion manufactured therefrom, the composition for a gel cushion comprising 5-8 parts by weight of an additive based on 100 parts by weight of a mixture of an oil and a copolymer which is obtained by polymerization of a polystyrene-based polymer and polypropylene.

The present invention relates to a composition for a gel cushion and to a gel cushion manufactured therefrom, the composition for a gel cushion comprising 5-8 parts by weight of an additive based on 100 parts by weight of a mixture of an oil and a copolymer which is obtained by polymerization of a polystyrene-based polymer and polypropylene.

Disclosed are exemplary embodiments of systems and methods of applying thermal interface materials (TIMs). The thermal interface materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.

The present invention relates to a road paving method enabling one to provide an asphalt paving material layer in which both excellent stability and stress relaxation can be made compatible with each other, the method including Step 1: a step of mixing asphalt, a thermoplastic elastomer, a polyester, and an aggregate to obtain an asphalt mixture, and Step 2: a step of laying the asphalt mixture obtained in Step 1 on a road, thereby forming an asphalt paving material layer, wherein the polyester has a softening point of 90° C. or higher and 140° C. or lower and a glass transition point of 40° C. or higher and 80° C. or lower, and a ratio of the polyester is more than 17 parts by mass and 50 parts by mass or less based on 100 parts by mass of the asphalt.

The present invention relates to a road paving method enabling one to provide an asphalt paving material layer in which both excellent stability and stress relaxation can be made compatible with each other, the method including Step 1: a step of mixing asphalt, a thermoplastic elastomer, a polyester, and an aggregate to obtain an asphalt mixture, and Step 2: a step of laying the asphalt mixture obtained in Step 1 on a road, thereby forming an asphalt paving material layer, wherein the polyester has a softening point of 90° C. or higher and 140° C. or lower and a glass transition point of 40° C. or higher and 80° C. or lower, and a ratio of the polyester is more than 17 parts by mass and 50 parts by mass or less based on 100 parts by mass of the asphalt.

The invention relates to a hot melt adhesive composition comprising a polymer component, the polymer component comprising at least one styrene-butadiene-styrene block copolymer P having a styrene content from 35 to 50% by weight; a styrene-butadiene diblock content from 50 to 80% by weight; and a viscosity of a 15% by weight toluene solution at 25° C. of 20 to 40 mPa.s, and at least one styrene block copolymer other than a styrene-butadiene-styrene block copolymer, wherein said styrene-butadiene-styrene block copolymer P is at a content from 10 to 40% by weight relative to the total weight of the polymer component. The invention also relates to the use of said composition as an adhesive for bonding two substrates, and to articles comprising at least one interior or exterior surface coated with said composition.

The invention relates to a hot melt adhesive composition comprising a polymer component, the polymer component comprising at least one styrene-butadiene-styrene block copolymer P having a styrene content from 35 to 50% by weight; a styrene-butadiene diblock content from 50 to 80% by weight; and a viscosity of a 15% by weight toluene solution at 25° C. of 20 to 40 mPa.s, and at least one styrene block copolymer other than a styrene-butadiene-styrene block copolymer, wherein said styrene-butadiene-styrene block copolymer P is at a content from 10 to 40% by weight relative to the total weight of the polymer component. The invention also relates to the use of said composition as an adhesive for bonding two substrates, and to articles comprising at least one interior or exterior surface coated with said composition.

A binder for an injection moulding composition, the binder includes, in percentage by mass and for a total of 100%: 35% to 60% of a component (a), or polymer base, made of a polymer or a mixture of polymers, each of the polymer being non-amphiphilic and having a mass average molar mass greater than or equal to 5,000 g/mol, 30% to 55% of a component (b), or wax, made of a polymer or a mixture of polymers, each of the polymer being non-amphiphilic and having a mass average molar mass less than 5,000 g/mol, and less than 10% of an amphiphilic component (c), or surfactant, and less than 10% of other components (d). The polymer base comprising 2% to 15% of a styrene-ethylene-butylene-styrene copolymer (SEBS), in percentage by mass based on the mass of the binder.