C09D161/34

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING NOVOLAC RESIN REACTED WITH AROMATIC METHYLOL COMPOUND

A resist underlayer film for lithography has high solubility in a resist solvent (solvent used in lithography) for expressing good coating film forming property and a smaller selection ratio of dry etching rate as compared with a resist. A resist underlayer film-forming composition containing a novolac resin containing a structure (C) obtained by a reaction of an aromatic ring of an aromatic compound (A) with a hydroxy group-containing aromatic methylol compound (B). The aromatic compound (A) may be a component constituting the structure (C) in the novolac resin. The hydroxy group-containing aromatic methylol compound (B) may be a compound of Formula (1):

##STR00001##

The hydroxy group-containing aromatic methylol compound (B) may be 2-hydroxybenzyl alcohol, 4-hydroxybenzyl alcohol, or 2,6-di-tert-butyl-4-hydroxymethyl phenol.

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING NOVOLAC RESIN REACTED WITH AROMATIC METHYLOL COMPOUND

A resist underlayer film for lithography has high solubility in a resist solvent (solvent used in lithography) for expressing good coating film forming property and a smaller selection ratio of dry etching rate as compared with a resist. A resist underlayer film-forming composition containing a novolac resin containing a structure (C) obtained by a reaction of an aromatic ring of an aromatic compound (A) with a hydroxy group-containing aromatic methylol compound (B). The aromatic compound (A) may be a component constituting the structure (C) in the novolac resin. The hydroxy group-containing aromatic methylol compound (B) may be a compound of Formula (1):

##STR00001##

The hydroxy group-containing aromatic methylol compound (B) may be 2-hydroxybenzyl alcohol, 4-hydroxybenzyl alcohol, or 2,6-di-tert-butyl-4-hydroxymethyl phenol.

Method for coating pipe with acid-curable resin and acid curing agent

In the coating method, a pipe for transporting oil and/or gas mined from underground is provided. An acid curable resin is passed through the pipe to adhere the acid curable resin to at least a part of an inner wall of the pipe. Then, an acid curing agent is passed through the pipe to allow the acid curing agent to make contact with the acid curable resin such that the acid curable resin is cured.

Method for coating pipe with acid-curable resin and acid curing agent

In the coating method, a pipe for transporting oil and/or gas mined from underground is provided. An acid curable resin is passed through the pipe to adhere the acid curable resin to at least a part of an inner wall of the pipe. Then, an acid curing agent is passed through the pipe to allow the acid curing agent to make contact with the acid curable resin such that the acid curable resin is cured.

Polymer, organic layer composition, and method of forming patterns

Disclosed are a polymer including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, an organic layer composition including the polymer, and a method of forming patterns using the organic layer composition. ##STR00001## The Chemical Formulae 1 and 2 are the same as defined in the specification.

Process for preparing liquid compositions of etherified melamine formaldehyde resins

The present invention relates to a process for preparing liquid compositions of etherified melamine formaldehyde resins, namely melamine formaldehyde resins etherified with a primary C.sub.1-C.sub.6-alkanol, which have low formaldehyde contents. The invention also relates to such liquid compositions of etherified melamine formaldehyde resins having a content of free formaldehyde of less than 0.3% by weight. The liquid compositions of etherified melamine formaldehyde resins are useful as crosslinking agents in coating compositions.

Process for preparing liquid compositions of etherified melamine formaldehyde resins

The present invention relates to a process for preparing liquid compositions of etherified melamine formaldehyde resins, namely melamine formaldehyde resins etherified with a primary C.sub.1-C.sub.6-alkanol, which have low formaldehyde contents. The invention also relates to such liquid compositions of etherified melamine formaldehyde resins having a content of free formaldehyde of less than 0.3% by weight. The liquid compositions of etherified melamine formaldehyde resins are useful as crosslinking agents in coating compositions.

GLASS-RESIN COMPOSITE-BASED MULTI-COMPOSITE MATERIAL
20220009286 · 2022-01-13 ·

Multicomposite material (R1, R2) including at least one monofilament (10) made of glass-resin composite including glass filaments (101) embedded in a thermoset polyester resin (102), this monofilament being covered with at least two superposed layers of different materials, a first layer (12) arranged on the surface of the monofilament and a second layer (14) of polyester thermoplastic material sheathing the whole, characterized in that the first layer (12) is a layer of benzoxazine and/or polybenzoxazine; finished articles or semi-finished products made of rubber, such as vehicle tyres, reinforced with such a material.

Composition for resist underlayer film formation, resist underlayer film and method for forming the same, and production method of a patterned substrate

A composition for resist underlayer film formation contains: a first compound including at least one oxazine structure fused to an aromatic ring; and a solvent. The first compound preferably includes a partial structure represented by formula (1). In formula (1), R.sup.2 to R.sup.5 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; Ar.sup.1 represents a group obtained by removing (n+3) or (n+2) hydrogen atoms on the aromatic ring from an arene having 6 to 20 carbon atoms; R.sup.6 represents a hydroxy group, a halogen atom, a nitro group or a monovalent organic group having 1 to 20 carbon atoms; and n is an integer of 0 to 9. ##STR00001##

Resist underlayer film-forming composition containing novolac resin reacted with aromatic methylol compound

A resist underlayer film for lithography has high solubility in a resist solvent (solvent used in lithography) for expressing good coating film forming property and a smaller selection ratio of dry etching rate as compared with a resist. A resist underlayer film-forming composition containing a novolac resin containing a structure (C) obtained by a reaction of an aromatic ring of an aromatic compound (A) with a hydroxy group-containing aromatic methylol compound (B). The aromatic compound (A) may be a component constituting the structure (C) in the novolac resin. The hydroxy group-containing aromatic methylol compound (B) may be a compound of Formula (1): ##STR00001## The hydroxy group-containing aromatic methylol compound (B) may be 2-hydroxybenzyl alcohol, 4-hydroxybenzyl alcohol, or 2,6-di-tert-butyl-4-hydroxymethyl phenol.