Wax compositions may be obtained by subjecting one or more linear alpha olefins to olefin metathesis and optionally hydrogenating. The wax compositions comprise: a hydrocarbon substance comprising a linear olefin dimer formed from a first linear alpha olefin having m carbon atoms and a second linear alpha olefin having n carbon atoms, a hydrogenated or partially hydrogenated reaction product of the linear olefin dimer, or any combination thereof, the first linear alpha olefin and the second linear alpha olefin being the same or different, and the linear olefin dimer comprising two carbon atoms less than a sum of m and n; wherein m and n are independently selected integers each ranging from 12 to 100; and wherein the wax composition has a melting point of 25° C. or greater.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

Adhesive and additive for adhesive made from post-consumer polypropylene.

Adhesive and additive for adhesive made from post-consumer polypropylene.

A composition contains (A) an ethylene/α-olefin copolymer having a density from 0.855 g/cc to 0.895 g/cc and a melt viscosity, at 177° C., from 5,000 mPa-s to 50,000 mPa-s; (B) a functionalized propylene-based polymer containing from 1 wt % to 10 wt % functional groups, the functionalized propylene-based polymer having a melt viscosity, at 190° C., from greater than 10,000 mPa-s to 50,000 mPa-s and a weight average molecular weight, Mw, greater than 30,000 g/mol; (C) a tackifier; and (D) a wax.

A rheology control agent for a curable composition may include: a diamide compound (A) and/or a hydrogenated castor oil (A′), the diamide compound (A) being obtained by condensation reaction between a diamine component (A1) and a monocarboxylic acid component (A2); and a polyamide compound (B) obtained by polycondensation of an amine component (B1) and a carboxylic acid component (B2). The diamine component (A1) may be selected from the group consisting of diamines with 2 to 12 carbon atoms. The monocarboxylic acid component (A2) may be selected from the group consisting of hydrogenated castor oil fatty acids and linear saturated fatty acids. The polyamide compound (B) may have a weight-average molecular weight from 2,000 to 21,000. A cured product of the curable composition may be used for a sealant or an adhesive.