Patent classifications
C09J2467/008
COLOR CONVERSION SHEET AND BACKLIGHT UNIT COMPRISING SAME
The present invention provides a color conversion sheet comprising: a first wavelength conversion layer in which an organic phosphor is dispersed in a resin matrix; and an adhesive layer disposed on one surface of the first wavelength conversion layer, in which a surface energy of the first wavelength conversion layer is different from a surface energy of the adhesive layer so that the organic phosphor does not diffuse into the adhesive layer.
Protective cover assembly and protected electronic device
A protective cover assembly and a protected electronic device are provided. The protective cover assembly for example includes: a silicone base, having an inner surface and an outer surface opposite to the inner surface; a patterned double-sided adhesive layer, attached onto the inner surface of the silicone base; and a releasable protective paper, attached onto a side of the patterned double-sided adhesive layer facing away from the inner surface of the silicone base and thereby the patterned double-sided adhesive layer is sandwiched between the silicone base and the releasable protective paper. The protective cover assembly can be applied for protecting a keypad and/or display part of an electronic device to thereby make the protected electronic device gain a liquid sealing and corrosion-resistant performance and the service life is prolonged consequently.
ACTIVATING SURFACES FOR SUBSEQUENT BONDING
A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.
Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
A BARRIER FREE STABLE QUANTUM DOT FILM
A barrier free quantum dot particles film includes a free standing layer comprising shielded quantum dot particles; wherein the shielded quantum dot particles are formed by shielding quantum dot particles by at least one shielding method; wherein the shielded quantum dot particles are characterized in resisting at least one condition selected from the group consisting of high temperature, high humidity and water; and wherein the shielded quantum dot particles are dispersed in an acrylate adhesive. A method of fabricating a barrier free quantum dot particles free standing film is also disclosed. The method of fabrication of shielded quantum dot particles film on a light emitting diode (LED) lens is also disclosed.
Barrier free stable quantum dot film
A barrier free quantum dot particles film includes a free standing layer comprising shielded quantum dot particles; wherein the shielded quantum dot particles are formed by shielding quantum dot particles by at least one shielding method; wherein the shielded quantum dot particles are characterized in resisting at least one condition selected from the group consisting of high temperature, high humidity and water; and wherein the shielded quantum dot particles are dispersed in an acrylate adhesive. A method of fabricating a barrier free quantum dot particles free standing film is also disclosed. The method of fabrication of shielded quantum dot particles film on a light emitting diode (LED) lens is also disclosed.
PRE-TREATMENT COMPOSITION
The present disclosure relates to a pre-treatment composition for sealing polymeric film, said composition comprising: 0.5 to 10 weight % of a halogenated carboxylic acid, a surfactant, and a liquid solvent.
BIOFIBER FILM
A thin film laminate having high percentages of biomass microparticles, and methods of making the same involve mixing biomass-microfibers with an adhesive, wherein the mixture comprises at least 50% biomass-microfibers by weight, heating the mixture above the melt temperature of the adhesive, and disposing the heated mixture between plastic sheets.
Techniques for making and using holding straps with hook-and-strap attachment
There are provided a holding strap, methods of making the same, and methods using such holding strap for tying down objects on a flatbed of a vehicle, retaining underground tanks, or lifting electrodes out of an electrolytic cell. The holding strap includes a chemically pre-treated strap component, an epoxy resin chemically bonded to the pre-treated strap component, and a hook component comprising a cavity that is configured and sized to receive at least a portion of the strap component, the epoxy resin being chemically bonded to internal surfaces of the cavity, so as to form the holding strap.
IMAGE FRAME AND METHOD OF MANUFACTURING THE SAME
Provided is an image frame includes a polymer film including an image layer on a first main surface of the polymer film; a glass cover layer located over the first main surface of the polymer film with the image layer between the glass cover layer and the polymer film; and an adhesive film between the polymer film and the glass cover layer. The image frame may be displayed in more various forms without distortion and may be preserved long time without quality degradation.
ADHESIVE COMPOSITION, ORGANIC FIBER AND TREATING METHOD THEREOF, AND METHOD OF FORMING ORGANIC FIBER/RUBBER COMPOSITE
The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.