A pressure-sensitive adhesive tape for a battery outer packaging including: a base material; and a pressure-sensitive adhesive layer arranged on one surface of the base material, where a value calculated from an expression “a loss modulus of elasticity (G″) of the pressure-sensitive adhesive tape for a battery outer packaging at 70° C.×a thickness (mm) of the pressure-sensitive adhesive layer/a thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging” is 8×10.sup.3 Pa or more; a value calculated from an expression “a storage modulus of elasticity (G′) of the pressure-sensitive adhesive tape for a battery outer packaging at 23° C. ×the thickness (mm) of the pressure-sensitive adhesive layer/the thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging” is 3×10.sup.5 Pa or less; and a pressure-sensitive adhesive strength of the pressure-sensitive adhesive tape for a battery outer packaging to a stainless-steel plate at 23° C. is 2 N/10 mm or more.

A thin adhesive tape includes a base and an adhesive layer provided on one surface of the base, wherein the base has a thickness of 2 to 25 μm, the adhesive layer has a thickness of 0.1 to 10 μm, the adhesive tape has a thickness of 30 μm or less, the adhesive tape has a peel adhesion of 0.50 N/10 mm or more in accordance with JIS Z 0237:2000, and the adhesive tape has a strength to repel members calculated by the following formula of 70 MPa.Math.mm or less, the adhesive tape being excellent in a balance between fixability of members and followability to members:
Strength to repel members (MPa.Math.mm)=tensile elastic modulus (MPa) of adhesive tape×thickness (mm) of adhesive tape.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

This invention relates to a coating composition comprising an ionomer having a polymer backbone and side chains, the side chains comprising ionic groups, wherein the ionic groups are sulfonic acid groups and sulfonate groups, from 50 to 95% of the total number of sulfonic acid groups and sulfonate groups are in the sulfonate form, and the sulfonate groups have counter ions M selected from the group consisting of lithium, sodium, magnesium, calcium, and mixtures thereof. This invention also relates to an article comprising a polymeric substrate having an antistatic coating thereon, wherein the antistatic coating is formed from the inventive coating composition. The article may be a cable, a cable cover or a cable jacket.

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Pressure-sensitive adhesive formulations based on acrylic or rubber adhesives are provided in combination with an aluminum phosphorous salt intumescent flame retardant and a nitrogen containing flame retardant which can act as a blowing agent through thermal decomposition. These flame retardant additives can be incorporated into the adhesive in levels of 10 to 30 percent by weight. These formulations are then placed on a polymeric flame retardant substrate in either a single-sided or double-sided form.

A thin adhesive tape includes a base and an adhesive layer provided on one surface of the base, wherein the base has a thickness of 2 to 25 m, the adhesive layer has a thickness of 0.1 to 10 m, the adhesive tape has a thickness of 30 m or less, the adhesive tape has a peel adhesion of 0.50 N/10 mm or more in accordance with JIS Z 0237:2000, and the adhesive tape has a strength to repel members calculated by the following formula of 70 MPa.Math.mm or less, the adhesive tape being excellent in a balance between fixability of members and followability to members:

Strength to repel members (MPa.Math.mm)=tensile elastic modulus (MPa) of adhesive tapethickness (mm) of adhesive tape.

Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member (11) containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member (12) containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.

ESD labels with a polyester-amino topcoat are provided. The labels may also include a polyester-amino resin in a primer layer. The topcoat and primer layer may comprise conductive particles, and the percentage of conductive particles in the adhesive layer may be reduced. The ESD labels have reduced surface resistance in the topcoat, primer layer, and adhesive layer, while also having reduced peel-off voltage.