The invention relates to a cationically curable composition with at least one cationically polymerizable component, a first photoinitiator releasing an acid when irradiated with actinic radiation of a first wavelength λ.sub.1, and a second photoinitiator releasing an acid when irradiated with actinic radiation of a second wavelength λ.sub.2, wherein the second wavelength λ.sub.2 is shorter than the first wavelength λ.sub.1, and wherein the second photoinitiator, after irradiation of the composition with actinic radiation of the first wavelength λ.sub.1, shows an absorption of actinic radiation of the second wavelength λ.sub.2 in the composition that is sufficient to activate the second photoinitiator and fix the composition. Furthermore, a method is described for the joining, casting, molding, sealing and/or coating of substrates using the cationically curable composition.

According to the present invention, there is provided a resin composition for sealing containing (A) an epoxy resin; (B) a curing agent; and (C) a filler, wherein the epoxy resin (A) includes an epoxy resin (A-1) having a naphthyl ether skeleton, and wherein the resin composition for sealing satisfies the following Formula (1): Formula (1) E.sub.2×(α.sub.2×10.sup.−6)×(175−Tg)×η.sub.2≤0.3

wherein, in Formula (1), Tg (° C.) is a glass transition temperature of a cured product of the resin composition for sealing,
α.sub.2 (ppm/° C.) is a coefficient of linear expansion over a range from 190° C. to 230° C. of the cured product, and
E.sub.2 (MPa) is a hot elastic modulus at 260° C. of the cured product, and
η.sub.2 (MPa) is a rectangular pressure at 175° C. of the resin composition for sealing as measured by the following method;
(method)
the resin composition for sealing is injected, using a low-pressure transfer molding machine, into a rectangular-shaped flow channel having a width of 15 mm, a thickness of 1 mm, and a length of 175 mm under conditions of a mold temperature of 170° C. and an injection flow rate of 177 mm.sup.3/sec, a change in pressure over time is measured with a pressure sensor embedded at a position 25 mm away from an upstream tip of the flow channel, a lowest pressure (MPa) during a flow of the resin composition for sealing is measured, and the lowest pressure is regarded as the rectangular pressure.

Provided are a liquid epoxy resin sealing material capable of suppressing occurrence of fillet cracks generated when an underfill cured product is left under high temperature aerobic conditions, and a semiconductor device using the liquid epoxy resin sealing material. More specifically, provided are the liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by the following formula, wherein 0.5 to 10 parts by mass of (D) the antioxidant agent is contained based on a total of 100 parts by mass of (A) the epoxy resin and (B) the amine curing agent, and the semiconductor device using the liquid epoxy resin sealing material.

The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

Provided are sealant compositions that include a first component and second component. The first component contains a polysulfide, a polythioether, or a copolymer or combination thereof containing pendant or terminal thiol groups, while the second in component contains an ethylenically-unsaturated compound and either the first or second component further contains a photoinitiator. Alternatively, the second component can contain a polyepoxide and either the first or second component can contain a photolatent base and a photosensitizer. The first or second component further contains a colorant that substantially reflects or substantially transmits light over the wavelength range from 350 nm to 500 nm. These compositions can provide cure-on-demand sealant formulations that comply with Class B sealant regulations on color, provide an acceptable depth of cure, and allow two-part mixing to be easily distinguishable.

A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

The present invention provides a sealing resin composition containing a polyester resin (A), carbodiimide (B) and an antioxidant (C).

A resin composition for molding and an electronic component device are provided. The resin composition for molding includes: a curable resin; and an inorganic filler including a calcium titanate particle.