The present invention relates to compositions such as cleaning compositions comprising a mix of enzymes. The invention further relates, use of compositions comprising such enzymes in cleaning processes.

The present invention relates to compositions such as cleaning compositions comprising a mix of enzymes. The invention further relates, use of compositions comprising such enzymes in cleaning processes.

A treatment liquid is a treatment liquid including water; a cationic compound; an anionic compound selected from the group consisting of a resin having a carboxy group or a salt thereof, a resin having a sulfo group or a salt thereof, a resin having a phosphorous acid group or a salt thereof, and a resin having a phosphoric acid group or a salt thereof; and an oxidizing agent, in which the treatment liquid has a pH of 7.0 or less, and the treatment liquid is substantially free of abrasive grains.

A treatment liquid is a treatment liquid including water; a cationic compound; an anionic compound selected from the group consisting of a resin having a carboxy group or a salt thereof, a resin having a sulfo group or a salt thereof, a resin having a phosphorous acid group or a salt thereof, and a resin having a phosphoric acid group or a salt thereof; and an oxidizing agent, in which the treatment liquid has a pH of 7.0 or less, and the treatment liquid is substantially free of abrasive grains.

An object of the present invention is to provide a cleaning liquid for a semiconductor substrate, which has excellent corrosion prevention performance for a metal-containing layer. In addition, another object of the present invention is to provide a method for cleaning a semiconductor substrate.

The cleaning liquid of an embodiment of the present invention is a cleaning liquid for a semiconductor substrate that has been subjected to a chemical mechanical polishing treatment, in which the cleaning liquid includes a component A having two or more onium structures in a molecule, and water, and has a pH of 7.0 to 11.8 at 25° C.

An object of the present invention is to provide a cleaning liquid for a semiconductor substrate, which has excellent corrosion prevention performance for a metal-containing layer. In addition, another object of the present invention is to provide a method for cleaning a semiconductor substrate.

The cleaning liquid of an embodiment of the present invention is a cleaning liquid for a semiconductor substrate that has been subjected to a chemical mechanical polishing treatment, in which the cleaning liquid includes a component A having two or more onium structures in a molecule, and water, and has a pH of 7.0 to 11.8 at 25° C.

The present disclosure describes antimicrobial, sanitizing and other applications employing a synergistic combination of a quaternary ammonium compound and an anionic surfactant. The present disclosure is also related to non-antimicrobial applications employing a synergistic combination of a quaternary ammonium compound and an anionic and/or nonionic surfactant. The present disclosure is related to various forms of concentrated or use compositions containing the quaternary ammonium compound and an anionic surfactant (and in certain embodiments nonionic surfactants). In particular, the present disclosure provides compositions having desired foaming enhancement and methods employing the same for applications such as pot and pan compositions, hand soaps, facility sanitizing, and other soil removal applications with foam stabilization.

The present disclosure describes antimicrobial, sanitizing and other applications employing a synergistic combination of a quaternary ammonium compound and an anionic surfactant. The present disclosure is also related to non-antimicrobial applications employing a synergistic combination of a quaternary ammonium compound and an anionic and/or nonionic surfactant. The present disclosure is related to various forms of concentrated or use compositions containing the quaternary ammonium compound and an anionic surfactant (and in certain embodiments nonionic surfactants). In particular, the present disclosure provides compositions having desired foaming enhancement and methods employing the same for applications such as pot and pan compositions, hand soaps, facility sanitizing, and other soil removal applications with foam stabilization.

The object of the present invention concerns a hair restructuring association comprising or alternatively consisting of: (a) a quaternary ammonium salt of formula (I) and (b) at least one sulpho-derivative of vegetable fatty acids, wherein R.sub.5, R.sub.6 are independently chosen between hydrogen and a radical R.sub.0, R.sub.0 consists of the following structure of formula (II), R.sub.1 is chosen from the group consisting of: hydrogen, methyl, isopropyl, sec-butyl, isobutyl, ethylenemethylthio, benzyl, para-hydroxybenzyl and 3-methylene-1H-indole, R.sub.2, R.sub.3, R.sub.4 are independently chosen from the group consisting of: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl and tert-butyl, mX.sup.− is chosen from the group consisting of: formic acid, acetic acid, unsaturated monocarboxylic acids, adipic acid, aldaric acid, oxalic acid, phthalic acid, azelaic acid, sebacic acid, malonic acid, succinic acid, tartaric acid, glutaric acid, pimelic acid, maleic acid, malic acid, fumaric acid and suberic acid, isocitric acid, citric acid, fatty acids, acidic amino acids, keto acids and aromatic carboxylic acids, m is an integer number comprised between 1 and 22, n is comprised between 2 and 20.

The present invention is directed to biodegradable cleaning compositions, in particular hard surface cleaning compositions, and their use. The compositions according to the invention comprise one or more biosurfactants(s), one or more sorbitan ester(s) and one or more further surfactant(s), which is/are neither a biosurfactant nor a sorbitan ester.