Patent classifications
C22B5/02
Copper/tin/lead production
A disclosed dilute copper metal composition has 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes partially b) oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal. The process further includes oxidizing h) the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed through steps b) and/or h) is retrieved in the first and second copper refining slags together, partially reducing c) the first copper refining slag to form a first lead-tin based metal composition and a first spent slag, adding the second copper refining slag to the first lead-tin based metal composition thereby forming a first liquid bath, partially oxidizing d) the first liquid bath, thereby obtaining the dilute copper metal composition.
IMPROVED SOLDER PRODUCTION PROCESS
A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition
A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.
IMPROVED SOLDER PRODUCTION PROCESS
A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition
A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.
Solder production process
A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.
Solder production process
A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.
Aluminum-based ultra-thin launder
The present invention relates to the field of alloy-smelting facilities, and provides an aluminum-based ultra-thin launder. The launder has a body with a wall thickness of 12 mm to 25 mm. The body has a segmented structure, including a part of alloy in, a first launder, a second launder and a part of alloy out that are connected in sequence. The body of the launder provided in the present invention is lighter and thinner. The cost of production and use is reduced due to the significantly-decreased wall thickness and weight. The connection mode for components of the body is changed, which is beneficial to the replacement, and fundamentally lowers the risk of a repair material contaminating melted alloy.
Aluminum-based ultra-thin launder
The present invention relates to the field of alloy-smelting facilities, and provides an aluminum-based ultra-thin launder. The launder has a body with a wall thickness of 12 mm to 25 mm. The body has a segmented structure, including a part of alloy in, a first launder, a second launder and a part of alloy out that are connected in sequence. The body of the launder provided in the present invention is lighter and thinner. The cost of production and use is reduced due to the significantly-decreased wall thickness and weight. The connection mode for components of the body is changed, which is beneficial to the replacement, and fundamentally lowers the risk of a repair material contaminating melted alloy.
COPPER/TIN/LEAD PRODUCTION
A dilute copper metal composition includes 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes the steps of partially oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal, partially oxidizing the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed is retrieved in the first and second copper refining slags together; and partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The process further includes the steps of adding the second copper refining slag to the first lead-tin based metal composition, thereby forming a first liquid bath; and partially oxidizing the first liquid bath, thereby obtaining the dilute copper metal composition.
Pyrorefining process
A disclosed process produces at least one concentrated copper product together with at least one crude solder product, starting from a black copper composition with at least 50% of copper together with at least 1.0% wt of tin and at least 1.0% wt of lead The process includes the step of partially oxidizing the black copper thereby forming a first copper refining slag, followed by partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The total feed to the reducing step includes an amount of copper that is at least 1.5 times as high as the sum of the amounts of Sn plus Pb present, and the first spent slag includes at most 20% wt total of copper, tin and lead together.
Pyrorefining process
A disclosed process produces at least one concentrated copper product together with at least one crude solder product, starting from a black copper composition with at least 50% of copper together with at least 1.0% wt of tin and at least 1.0% wt of lead The process includes the step of partially oxidizing the black copper thereby forming a first copper refining slag, followed by partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The total feed to the reducing step includes an amount of copper that is at least 1.5 times as high as the sum of the amounts of Sn plus Pb present, and the first spent slag includes at most 20% wt total of copper, tin and lead together.