Patent classifications
C25D3/54
Sn-BASED PLATED STEEL SHEET
To provide a Sn-based plated steel sheet capable of exhibiting superior corrosion resistance, yellowing resistance, coating film adhesiveness, and sulphide stain resistance without using a chromate film. A Sn-based plated steel sheet of the present invention includes: a steel sheet; a Sn-based plating layer located on at least one surface of the steel sheet; and a coating layer located on the Sn-based plating layer, wherein the Sn-based plating layer contains 1.0 g/m.sup.2 to 15.0 g/m.sup.2 of Sn per side in terms of metal Sn, the coating layer contains zirconium oxide, and a content of the zirconium oxide is 1.0 mg/m.sup.2 to 10.0 mg/m.sup.2 per side in terms of metal Zr, the zirconium oxide includes zirconium oxide with an amorphous structure, and a crystalline layer whose main component is zirconium oxide with a crystalline structure is present on an upper layer of the zirconium oxide with the amorphous structure.
Sn-BASED PLATED STEEL SHEET
To provide a Sn-based plated steel sheet capable of exhibiting superior corrosion resistance, yellowing resistance, coating film adhesiveness, and sulphide stain resistance without using a chromate film. A Sn-based plated steel sheet of the present invention includes: a steel sheet; a Sn-based plating layer located on at least one surface of the steel sheet; and a coating layer located on the Sn-based plating layer, wherein the Sn-based plating layer contains 1.0 g/m.sup.2 to 15.0 g/m.sup.2 of Sn per side in terms of metal Sn, the coating layer contains zirconium oxide, and a content of the zirconium oxide is 1.0 mg/m.sup.2 to 10.0 mg/m.sup.2 per side in terms of metal Zr, the zirconium oxide includes zirconium oxide with an amorphous structure, and a crystalline layer whose main component is zirconium oxide with a crystalline structure is present on an upper layer of the zirconium oxide with the amorphous structure.
Composition and method embodiments for plating metal coatings
Disclosed herein are embodiments of a coating composition and a method of using the same for forming metal coatings on substrates. In particular embodiments, the coating composition comprises a deep eutectic solvent and/or an ionic liquid; a metal precursor; an alkali metal salt; and an optional additive component. The coating composition and method embodiments disclosed herein provide durable, even, high-surface area coatings on various types of substrates and also can be used at low temperatures.
Composition and method embodiments for plating metal coatings
Disclosed herein are embodiments of a coating composition and a method of using the same for forming metal coatings on substrates. In particular embodiments, the coating composition comprises a deep eutectic solvent and/or an ionic liquid; a metal precursor; an alkali metal salt; and an optional additive component. The coating composition and method embodiments disclosed herein provide durable, even, high-surface area coatings on various types of substrates and also can be used at low temperatures.
PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME
In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
PHOTODEFINED APERTURE PLATE AND METHOD FOR PRODUCING THE SAME
In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
Boron doped diamond electrode and preparation method and applications thereof
A boron doped diamond electrode and its preparation method and application, the electrode is deposited with a boron or nitrogen doped diamond layer or a boron or nitrogen doped diamond layer composite layer on the surface of the electrode substrate, or after a transition layer is disposed on the surface of the substrate, a boron or nitrogen doped diamond layer or a composite layer of boron or nitrogen doped diamond layer is disposed on the surface of transition layer. The preparation method is depositing or plating a boron or nitrogen doped diamond layer on the surface of the electrode substrate, or providing a transition layer on the surface of the electrode substrate, and then depositing or plating a boron or nitrogen doped diamond layer or a composite layer of boron or nitrogen doped diamond layer on the surface of the transition layer.
PRODUCTION METHOD OF 225Ac
One embodiment of the present invention relates to a production method of .sup.225Ac includes; a production step of a .sup.226Ra target including an electrodeposition step of electrodepositing a .sup.226Ra-containing substance on a substrate by using an electrodeposition solution that contains .sup.226Ra ions and a pH buffer, and an irradiating step of irradiating the .sup.226Ra target with at least one selected from charged particles, photons, and neutrons.
METHOD FOR PRODUCING 225Ac
A method for producing 225.sup.A including: a method (X) for purifying a .sup.226Ra-containing solution, including an adsorption step of allowing a .sup.226Ra ion to adsorb onto a carrier having a function of selectively adsorbing a divalent cation by bringing a .sup.226Ra-containing solution into contact with the carrier under an alkaline condition, and an elution step of eluting the .sup.226Ra ion from the carrier under an acidic condition; a method for producing a .sup.226Ra target, including an electrodeposition liquid preparation step of preparing an electrodeposition liquid by using a purified .sup.226Ra-containing solution obtained by the method (X), and an electrodeposition step of electrodepositing a .sup.226Ra-containing substance on a substrate by using the electrodeposition liquid; and a step of irradiating a .sup.226Ra target produced by the method for producing a .sup.226Ra target with at least one selected from a charged particle, a photon, and a neutron by using an accelerator.
SLIDE MEMBER
Provided is a slide member having an overlay on a bearing alloy. The overlay has a thickness T and has a sliding surface and an interface with respect to the bearing alloy. The overlay includes an intermetallic compound and a matrix of Bi or a Bi alloy. In a thickness domain constituting 70%-75% of the thickness T of the overlay from the sliding surface to the interface, the volume proportion of the intermetallic compound is 10%-70%.