A method for preparing an electrode of an inductive component, includes: S1: performing surface insulation treatment, specifically including: placing an inductive component in a tilting and rotating spraying pot, and performing thermal spraying on resin by using a fixed spray gun for surface insulation treatment; S2: exposing an inner electrode, specifically including: processing an electrode area through laser or mechanical polishing to expose the inner electrode; S3: performing surface pretreatment, specifically including: performing degreasing and surface pretreatment with ultrasound in a special solution; S4: performing surface activation treatment, specifically including: performing surface activation treatment with ultrasound in a low-concentration acid solution; S5: electroplating to form a metal layer, specifically including: electroplating to form an electroplated copper layer first, then electroplating to form an electroplated nickel layer, and finally electroplating to form an electroplated tin layer; and S6: performing surface post-treatment.

A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 1×10.sup.6 W/cm.sup.2 to 1×10.sup.9 W/cm.sup.2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO.sub.3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.

A galvanically decorated component made of plastic has a galvanically applied chrome layer, wherein the chrome layer is processed with a laser in such a way that a mechanically applied brush structure or structure is reproduced on the surface. The component decorated in this way satisfies all requirements in accordance with the respective test specifications of the planned area of application. A method produces a plastic component having a structured surface. Components of this type made of plastic for the automotive industry are substantially decorative and operative elements.

A galvanically decorated component made of plastic has a galvanically applied chrome layer, wherein the chrome layer is processed with a laser in such a way that a mechanically applied brush structure or structure is reproduced on the surface. The component decorated in this way satisfies all requirements in accordance with the respective test specifications of the planned area of application. A method produces a plastic component having a structured surface. Components of this type made of plastic for the automotive industry are substantially decorative and operative elements.

The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<log(Ls)<6.0.

A method for forming a pattern in which a plating layer is selectively formed on a base material using a resin layer as a mask, includes resin layer-forming in which the resin layer is formed on the base material; and patterning in which the resin layer is selectively removed, in which in the patterning, a part of the resin layer is sublimed by heating to be removed.

A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 110.sup.6 W/cm.sup.2 to 110.sup.9 W/cm.sup.2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO.sub.3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.

A method for producing a control element made of plastic with backlit imagery that is metallized on one side, particularly for a motor vehicle, and a machine that is configured to carry out the aforementioned method, as well as to a control element with backlightable imagery.

A method for synchronous electroplating filling of differential vias and an electroplating device. Laser irradiation is adopted as an external energy field to assist synchronous electroplating filling of differential vias. A mask or digital maskless technology is used to precisely heat the vias with different positions and different sizes. The filling rate of different regions varies with the temperature difference, thereby realizing the synchronous electroplating filling of differential vias in one step. In the processes of immersion pre-wetting by the electroplating liquid and electroplating filling copper, the laser is used for preheating the wafer processed with vias. In these two steps, the laser needs to locally and precisely heat upper surfaces of the micro vias on the wafer through the mask corresponding to the micro vias on the wafer.

A method for synchronous electroplating filling of differential vias and an electroplating device. Laser irradiation is adopted as an external energy field to assist synchronous electroplating filling of differential vias. A mask or digital maskless technology is used to precisely heat the vias with different positions and different sizes. The filling rate of different regions varies with the temperature difference, thereby realizing the synchronous electroplating filling of differential vias in one step. In the processes of immersion pre-wetting by the electroplating liquid and electroplating filling copper, the laser is used for preheating the wafer processed with vias. In these two steps, the laser needs to locally and precisely heat upper surfaces of the micro vias on the wafer through the mask corresponding to the micro vias on the wafer.