A method for producing a wet-running friction paper includes providing a fiber portion with a fiber, providing a filler portion with a filler, providing a binder portion with a phenol-resin-based binder, dissolving the binder portion to form a phenolate, and processing the fiber portion, the filler portion and the phenolate in a paper production process to form the wet-running friction paper.

A cleaning sheet is interposed between resin molding mold surfaces and cleans the resin molding mold surfaces with a cleaning resin. The cleaning sheet is composed of a paper material, and is impregnated with a thermosetting resin and cured from the front surface layer to the back surface layer of the paper material.

A cleaning sheet is interposed between resin molding mold surfaces and cleans the resin molding mold surfaces with a cleaning resin. The cleaning sheet is composed of a paper material, and is impregnated with a thermosetting resin and cured from the front surface layer to the back surface layer of the paper material.

An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

A biocide resin composition that includes one or more solutions of selected melamine-formaldehyde, urea-formaldehyde, phenol-formaldehyde, melamine-urea-formaldehyde, and phenolic resins, and more than one copper salt soluble in aqueous systems and melamine-formaldehyde, urea-formaldehyde, and phenolic solutions. Copper salts are of the copper citrate, copper lysinate, copper gluconate, copper salicylate, copper phthalocyanine, copper chelate, copper oxalate, copper acetate, copper methionine, copper tartrate, copper glycinate, copper picolinate, copper aspartate, ammoniacal copper complexes, EDTA (ethylenediaminetetraacetic acid)-copper complexes, copper glycolate, copper glycerate, copper ascorbate type and, in general, copper salts of the organic type, R—Cu, R1-Cu—R2, where R, R1, and R2 can be alkyl chains (C.sub.3-C.sub.18) with one or more acid, aldehyde, ester, ether, hydroxyls, amino, or others groups in its structure.

A biocide resin composition that includes one or more solutions of selected melamine-formaldehyde, urea-formaldehyde, phenol-formaldehyde, melamine-urea-formaldehyde, and phenolic resins, and more than one copper salt soluble in aqueous systems and melamine-formaldehyde, urea-formaldehyde, and phenolic solutions. Copper salts are of the copper citrate, copper lysinate, copper gluconate, copper salicylate, copper phthalocyanine, copper chelate, copper oxalate, copper acetate, copper methionine, copper tartrate, copper glycinate, copper picolinate, copper aspartate, ammoniacal copper complexes, EDTA (ethylenediaminetetraacetic acid)-copper complexes, copper glycolate, copper glycerate, copper ascorbate type and, in general, copper salts of the organic type, R—Cu, R1-Cu—R2, where R, R1, and R2 can be alkyl chains (C.sub.3-C.sub.18) with one or more acid, aldehyde, ester, ether, hydroxyls, amino, or others groups in its structure.

A method for producing a roll-type gas diffusion layer is disclosed. The method includes preparing a carbon paper from carbon fiber chops having a low modulus of 10 to 100 Gpa; impregnating the prepared carbon paper with a phenol resin, and then carbonizing the resin-impregnated carbon paper at 1,800 to 2,400 C.; forming a microporous polytetrafluoroethylene resin layer on one side of the carbonized carbon paper, to prepare a gas diffusion layer sheet; and winding the prepared gas diffusion layer sheet on a roll. Since the roll of gas diffusion layer is formed using the carbon fiber chops having a low modulus, the gas diffusion layer exhibits excellent and uniform spreading properties. Therefore, sealing between the gas diffusion layer and the fuel cell separation plate is reliably secured without using a separate binder.

A method for producing a roll-type gas diffusion layer is disclosed. The method includes preparing a carbon paper from carbon fiber chops having a low modulus of 10 to 100 Gpa; impregnating the prepared carbon paper with a phenol resin, and then carbonizing the resin-impregnated carbon paper at 1,800 to 2,400 C.; forming a microporous polytetrafluoroethylene resin layer on one side of the carbonized carbon paper, to prepare a gas diffusion layer sheet; and winding the prepared gas diffusion layer sheet on a roll. Since the roll of gas diffusion layer is formed using the carbon fiber chops having a low modulus, the gas diffusion layer exhibits excellent and uniform spreading properties. Therefore, sealing between the gas diffusion layer and the fuel cell separation plate is reliably secured without using a separate binder.

A method for manufacturing a printing paper for decorative boards is provided. The method includes the processes of: applying a resin-containing liquid comprising at least one of a resin and a resin precursor to a base paper for decorative boards; forming a print layer on or in the base paper which is not dried after the resin-containing liquid is applied thereto; and solidifying a liquid contained in the base paper having the print layer.