In one aspect of a bottom indexing tile and support structure, a bottom indexing support structure may be engaged with a top portion of a pedestal. The bottom indexing support structure may be formed with a generally vertical spine having at least one rail extending outward from a distal end thereof and may also include one or more ridges extending upward in a direction parallel to the spine. The spine and rail(s) may be configured to secure one or more bottom indexing tiles, which tiles may be formed with a groove on at least one edge thereof, and wherein one or more rails may be positioned within the groove. The bottom indexing tile may be formed with one or more channels on a bottom surface thereof, wherein each channel may correspond with a ridge of the bottom indexing support structure.

An object of the invention is to provide a vibration isolation supporting structure and a vibration isolation system that can prevent a high-frequency vibration and a low-frequency vibration generated on a floor of a building. The vibration isolation supporting structure includes a plurality of supporting portions 21 erected facing each other in a predetermined area near a wall 4 of a floor 5 of a building, a supporting structure 22 supported on the floor 5 by the supporting portions 21, and a fixing device 24 configured to fix the supporting structure 22 to the floor 5, and when receiving a release command, the fixing device 24 releases fixing of the supporting structure 22 to the floor 5.

The invention relates to a floor cassette for the construction of a floating floor, the floor cassette comprising a wooden base panel and a plurality of wooden beams attached to one of the surfaces of the base panel, the beams being essentially parallel to one another, wherein the floor cassette further comprises a plurality of support devices mounted between two adjacent beams, the support devices comprising two ends respectively fixed at least to a lateral wall of the two adjacent beams, and a central part connecting the two ends, the central part being configured to support the floor so that the latter is not directly attached to the beams.

The invention relates to methods and devices for mounting a floating floor on a beam structure comprising a plurality of parallel beams, the method comprising positioning a plurality of devices placed at a regular distance and fixing said devices to the beams, the devices comprising a horizontally oriented support, and at least one fixing element comprising a vertical part configured to be secured to at least one lateral wall of a beam, the support being connected to the fixing element. The method also comprises mounting joists by inserting elements consisting of an acoustic insulating material on the supports of the devices, each joist being carried by at least two supports, the combined height of the joists and the acoustic elements being such that the upper surface of the joists is located at a greater height than the beams of the beam structure, and mounting the floor on the upper surfaces of the joists. The invention is furthermore related to a cassette comprising beams and support devices, for constructing a floating floor.

In one aspect of a bottom indexing tile and support structure, a bottom indexing support structure may be engaged with a top portion of a pedestal. The bottom indexing support structure may be formed with a generally vertical spine having at least one rail extending outward from a distal end thereof and may also include one or more ridges extending upward in a direction parallel to the spine. The spine and rail(s) may be configured to secure one or more bottom indexing tiles, which tiles may be formed with a groove on at least one edge thereof, and wherein one or more rails may be positioned within the groove. The bottom indexing tile may be formed with one or more channels on a bottom surface thereof, wherein each channel may correspond with a ridge of the bottom indexing support structure.

Covering comprising a structure formed by a plurality of panels provided on their lower face with at least one guide formed by a groove giving access to a cavity and longitudinal profiles perpendicular to said grooves on the panels, said profiles having, in turn, a guide and clips housed simultaneously in the cavities of both guides of the panel and the profile, the clips having a resilient body that is housed, in the expanded position, in the corresponding cavity, said body comprising at least two legs, each leg having, in turn, a shoulder area intended to make contact with the wall of the cavity immediately adjacent to the groove.

The invention relates to methods and devices for mounting a floating floor on a beam structure comprising a plurality of parallel beams, the method comprising positioning a plurality of devices placed at a regular distance and fixing said devices to the beams, the devices comprising a horizontally oriented support, and at least one fixing element comprising a vertical part configured to be secured to at least one lateral wall of a beam, the support being connected to the fixing element. The method also comprises mounting joists by inserting elements consisting of an acoustic insulating material on the supports of the devices, each joist being carried by at least two supports, the combined height of the joists and the acoustic elements being such that the upper surface of the joists is located at a greater height than the beams of the beam structure, and mounting the floor on the upper surfaces of the joists. The invention is furthermore related to a cassette comprising beams and support devices, for constructing a floating floor.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. The tool pedestal/pad for modern semiconductor FABs are required have very small tolerance to ambient vibration. Therefore, reduction and isolation of vibration of tool pedestal/pad is the key requirement for safe, reliable and uninterrupted operation of modern semiconductor FABs. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam.