The optical assembly disclosed in the embodiment includes a housing having an inclined bottom surface, a plurality of inner surfaces around an outer periphery of the bottom surface, and a receiving space in which an upper portion is opened; and a lighting module disposed on the inclined bottom surface, wherein the lighting module includes a substrate inclinedly disposed on the inclined bottom surface; at least one light emitting device disposed on the substrate; and a resin layer sealing the light emitting device and the substrate, wherein an upper surface of the resin layer emits light by diffusing light emitted from the light emitting device, wherein the plurality of inner surfaces includes a first inner surface adjacent to the light emitting device, a second inner surface facing the first inner surface, and third and fourth inner surfaces facing each other and disposed between the first and second inner surfaces, wherein a height between the bottom surface of the housing and an upper surface of the housing increases from the first inner surface toward the second inner surface, and decreases from the third inner surface toward the fourth inner surface.

A lens and an illumination method thereof relates to the field of illumination technologies. The lens is provided with a concave space for accommodating a light source, a first irradiation part is formed on a first side of an inner wall of the concave space, and second irradiation parts are formed on the bottom and a second side of the inner wall of the concave space; a main light beam emitted by the first irradiation part and a main light beam emitted by the second irradiation parts form an acute angle. By means of the present invention, an upper region and a lower region of a to-be-irradiated object can be illuminated through one light source at the same time, and the light source arrangement cost is reduced.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

A lighting device with improved luminous performance is provided, which includes a first light path, a second light path and a plurality of first light sources and second light sources. The first light path includes a plurality of first bending portions and second bending portions arranged in staggered arrangement. Each first bending portion and each second ending portion protrude from one side and the other side of a first reference line respectively. The first light sources are distributed over the second bending portions. The second light path is connected to the first light path in parallel, and includes a plurality of third bending portions and fourth bending portions arranged in the staggered arrangement. Each third bending portion and each fourth bending portion protrude from one side and the other side of a second reference line respectively. The second light sources are distributed over the third bending portions.

A lighting device with improved luminous performance is provided, which includes a first light path, a second light path and a plurality of first light sources and second light sources. The first light path includes a plurality of first bending portions and second bending portions arranged in staggered arrangement. Each first bending portion and each second ending portion protrude from one side and the other side of a first reference line respectively. The first light sources are distributed over the second bending portions. The second light path is connected to the first light path in parallel, and includes a plurality of third bending portions and fourth bending portions arranged in the staggered arrangement. Each third bending portion and each fourth bending portion protrude from one side and the other side of a second reference line respectively. The second light sources are distributed over the third bending portions.

The lighting device disclosed in the embodiment of the invention includes a substrate including a metal layer; a plurality of light sources arranged in a first direction on the substrate; a plurality of protrusions having a length in the first direction on the metal layer; and a resin layer disposed on the plurality of light sources and the plurality of protrusions, wherein the metal layer includes a first metal layer electrically connected to the light source and a second metal layer coupled to the plurality of protrusions, and the first metal layer and the second metal layer are separated from each other, and the plurality of protrusions may be disposed to be spaced apart from each other in a second direction perpendicular to the first direction.

The lighting device disclosed in the embodiment of the invention includes a substrate including a metal layer; a plurality of light sources arranged in a first direction on the substrate; a plurality of protrusions having a length in the first direction on the metal layer; and a resin layer disposed on the plurality of light sources and the plurality of protrusions, wherein the metal layer includes a first metal layer electrically connected to the light source and a second metal layer coupled to the plurality of protrusions, and the first metal layer and the second metal layer are separated from each other, and the plurality of protrusions may be disposed to be spaced apart from each other in a second direction perpendicular to the first direction.

Disclosed are RCLED lamp bead packaging process and RCLED lamp bead, which comprises steps of: dispensing a die-bonding glue, mounting a chip, baking, welding a bonding wire, dispensing a first layer of anti-reflection adhesive, baking, dispensing a second layer of anti-reflection adhesive, baking, and testing. Anti-reflection adhesive is dispensed in corresponding area to cover part capable of reflecting light in RCLED lamp bead and eliminate reflection effect effectively. The first layer of anti-reflection adhesive fills in specified area rapidly to achieve high production efficiency. The second layer of anti-reflection adhesive flows slowly after glue dispensing, so that the glue dispensing precision is improved and the light-emitting hole is prevent from being covered. When bonding wire is welded, a bracket is the first welding spot and a PAD of the chip is the second welding spot to achieve a lower radian of the bonding wire.

Disclosed are RCLED lamp bead packaging process and RCLED lamp bead, which comprises steps of: dispensing a die-bonding glue, mounting a chip, baking, welding a bonding wire, dispensing a first layer of anti-reflection adhesive, baking, dispensing a second layer of anti-reflection adhesive, baking, and testing. Anti-reflection adhesive is dispensed in corresponding area to cover part capable of reflecting light in RCLED lamp bead and eliminate reflection effect effectively. The first layer of anti-reflection adhesive fills in specified area rapidly to achieve high production efficiency. The second layer of anti-reflection adhesive flows slowly after glue dispensing, so that the glue dispensing precision is improved and the light-emitting hole is prevent from being covered. When bonding wire is welded, a bracket is the first welding spot and a PAD of the chip is the second welding spot to achieve a lower radian of the bonding wire.