The invention provides a luminescent element (1000) comprising a solid luminescent body (100), wherein the solid luminescent body (100) comprises a luminescent material (200), wherein the luminescent material (200) is configured to generate luminescent material light (201) upon excitation with light having a wavelength where the luminescent material (200) is excitable, wherein the solid luminescent body (100) comprises luminescent body faces (120), wherein the luminescent element (1000) further comprises one or more reflective elements (300) associated to at least one luminescent body face (120), wherein the one or more reflective elements (300) are metallic, and wherein a surface coverage of the at least one luminescent body face (120) with the one or more reflective elements (300) is selected from the range of 5-40%.

A wavelength conversion element according to an embodiment of the present disclosure includes: a phosphor layer including a plurality of phosphor particles; a refrigerant that cools the phosphor layer; a storage section that stores the phosphor layer and the refrigerant; and a light-transmissive section that seals the storage section in combination with the storage section, and controls an output direction of output light outputted from the phosphor layer.

A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

A lighting device is provided that includes light emitting unit that emits primary light and a light conversion element that is illuminated with the primary light and emits secondary light of another wavelength. The light conversion element has a front side defining a primary light receiving surface that received the primary light and a secondary light emitting surface that emits the secondary light. The light conversion element has a variable thickness at the primary light receiving surface and/or in the secondary light emitting surface.

A lighting device is provided that includes light emitting unit that emits primary light and a light conversion element that is illuminated with the primary light and emits secondary light of another wavelength. The light conversion element has a front side defining a primary light receiving surface that received the primary light and a secondary light emitting surface that emits the secondary light. The light conversion element has a variable thickness at the primary light receiving surface and/or in the secondary light emitting surface.

Disclosed is a modular housing for drivers used for LED lamps. The housing includes connectors for AC in from a power source, DC out to the lamps, and also has connectors allowing for control lines to be received from a control box. The housing includes an arrangement for creating two opposite stacks of drivers. The fronts of the drivers are cooled by circulating air through the space between the stacks, and heat is also dissipated through the side walls of the housing, which acts as a heat sink. The number and specifications of the drivers in the housing are configured such that every module is able to serve a number of LED lamps.

Disclosed is a modular housing for drivers used for LED lamps. The housing includes connectors for AC in from a power source, DC out to the lamps, and also has connectors allowing for control lines to be received from a control box. The housing includes an arrangement for creating two opposite stacks of drivers. The fronts of the drivers are cooled by circulating air through the space between the stacks, and heat is also dissipated through the side walls of the housing, which acts as a heat sink. The number and specifications of the drivers in the housing are configured such that every module is able to serve a number of LED lamps.

A wavelength conversion member for soldering includes a ceramic fluorescent body for converting a wavelength of light entering from an incident surface of the ceramic fluorescent body, a reflection layer disposed on a back surface of the ceramic fluorescent body on a side opposite the incident surface and partially or entirely covering the back surface, and a junction layer composed of one or more films and covering at least the reflection layer selected from the back surface of the ceramic fluorescent body and the reflection layer. The junction layer has a projecting portion which projects, in relation to an outer circumferential portion of the junction layer, in a center portion of a surface on a side opposite a surface on a side where the junction layer covers at least the reflection layer selected from the back surface and the reflection layer.

The invention provides a light generating system (1000), comprising a plurality of light sources (10), an elongated luminescent body (100), and a body holder structure (2000), wherein: —the plurality of light sources (10) are configured to provide light source light (11), wherein the light sources (10) are solid state light sources, wherein the plurality of light sources (10) are configured in a light source array (15); —the elongated luminescent body (100) has a length (L) and a width (W), wherein the elongated luminescent body (100) comprises luminescent material (120) configured to convert at least part of light source light (11) into luminescent material light (8), wherein the elongated luminescent body (100) and the light source array (15) are configured parallel; —the body holder structure (2000) comprises an elongated slit (205) for hosting the elongated luminescent body (100), wherein the elongated slit (205) has a cavity wall (1205) defining the elongated slit (205) and a slit opening (1206), wherein the slit opening (1206) has a slit opening width (WS1), wherein the cavity wall (1205) and the elongated luminescent body (100) have first shortest distances (d11) that vary over the cavity wall (1205), wherein at least part of the cavity wall (1205) is reflective for light source light (11); —the light sources (10) are configured at second shortest distances (d21) from the elongated luminescent body (100), wherein the second shortest distance (d21) is selected from the range of 40-1000 μm, and wherein one or more of the plurality of light sources (10) are configured to irradiate with the light source light (11) the elongated luminescent body (100) both (i) directly and (ii) indirectly via the cavity wall (1205).

There is provided a light-emitting device (1) including: a light-emitting element (20); a light-transmissive heat dissipation member (11) having a plate shape; a wavelength conversion member (12) that takes in, from a side of a light scattering layer (12a), light that is emitted from the light-emitting element (20) and passes through the light-transmissive heat dissipation member (11), and converts a wavelength in a fluorescent layer (12b); a lateral heat dissipation member that has a plate shape, includes a high-heat conduction member (13) in contact with a side surface of the wavelength conversion member (12) via a light reflection member (14), and is in contact with an upper surface of the light-transmissive heat dissipation member (11); and a package (21) that houses the light-emitting element (20) and supports a wavelength conversion unit (100) including the light-transmissive heat dissipation member (11), the wavelength conversion member (12), and the lateral heat dissipation member.