A method of operating a heat exchanger is disclosed in which an electric field is applied to a hydrophobic surface having condensed water droplets thereon to reduce a contact angle between the individual droplet surfaces and the hydrophobic surface, and to increase droplet surface energy to a second surface energy level. The electric field is removed to increase the contact angle between the individual droplet surfaces and the hydrophobic surface, and to reduce droplet surface energy to a third surface energy level. The third surface energy level is greater than the first surface energy level and greater than a surface energy level for a free droplet. A portion of the droplet surface energy is converted to kinetic energy to detach droplets from the hydrophobic surface. The detached droplets are removed from the heat rejection side fluid flow path.

A method of operating a heat exchanger is disclosed in which an electric field is applied to a hydrophobic surface having condensed water droplets thereon to reduce a contact angle between the individual droplet surfaces and the hydrophobic surface, and to increase droplet surface energy to a second surface energy level. The electric field is removed to increase the contact angle between the individual droplet surfaces and the hydrophobic surface, and to reduce droplet surface energy to a third surface energy level. The third surface energy level is greater than the first surface energy level and greater than a surface energy level for a free droplet. A portion of the droplet surface energy is converted to kinetic energy to detach droplets from the hydrophobic surface. The detached droplets are removed from the heat rejection side fluid flow path.

A system includes a matrix material to remove heat from an object. The matrix material includes a plurality of vascular structures. Each of the vascular structures are filled with a fluid. At least one transducer generates field-induced forces into the fluid within the vascular structures of the matrix material. At least one controller pulses the transducer to generate the field-induced forces into the fluid within the vascular structures. The field-induced forces generate fluid flow within the vascular structures to remove the heat from the object.

A system for reducing evaporative cooling water losses using an electric and magnetic field inducing device is disclosed. The device influences a liquid's properties including evaporation rate, diffusion, vapor, heat transfer rate, and/or fluid properties. The device comprises a malleable core with notches and electrically conductive windings wrapped around the flexible core around the notches. An insulative coating isolates the windings from the core. The device is pliable and is wrapped and/or attached around a conduit (e.g., a makeup line or pipe or a recirculating line or pipe of an evaporative cooling tower) with flowing fluid and current is passed through the windings to treat the fluid.

A system for reducing evaporative cooling water losses using an electric and magnetic field inducing device is disclosed. The device influences a liquid's properties including evaporation rate, diffusion, vapor, heat transfer rate, and/or fluid properties. The device comprises a malleable core with notches and electrically conductive windings wrapped around the flexible core around the notches. An insulative coating isolates the windings from the core. The device is pliable and is wrapped and/or attached around a conduit (e.g., a makeup line or pipe or a recirculating line or pipe of an evaporative cooling tower) with flowing fluid and current is passed through the windings to treat the fluid.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

A pump includes a collecting duct to guide a two-phase fluid provided with magnetic field responsive particles, a collecting duct magnet system arranged along the collecting duct and configured to generate a magnetic field in at least a part of the collecting duct, a pumping duct to guide the two-phase fluid, a pumping duct inlet being connected to a collecting duct outlet, and a pumping duct magnet system arranged along the pumping duct and configured to generate a magnetic field in at least a part of the pumping duct. A pump driver is configured to drive the collecting duct magnet system to generate a spatial repetition of collecting duct magnetic fields moving along a length of the collecting duct, and is configured to drive the pumping duct magnet system to generate a spatial repetition of pumping duct magnetic fields moving along a length of the pumping duct.

A pump includes a collecting duct to guide a two-phase fluid provided with magnetic field responsive particles, a collecting duct magnet system arranged along the collecting duct and configured to generate a magnetic field in at least a part of the collecting duct, a pumping duct to guide the two-phase fluid, a pumping duct inlet being connected to a collecting duct outlet, and a pumping duct magnet system arranged along the pumping duct and configured to generate a magnetic field in at least a part of the pumping duct. A pump driver is configured to drive the collecting duct magnet system to generate a spatial repetition of collecting duct magnetic fields moving along a length of the collecting duct, and is configured to drive the pumping duct magnet system to generate a spatial repetition of pumping duct magnetic fields moving along a length of the pumping duct.

The electronic device includes a housing that surrounds one or more components of the device and has front, back, top and bottom sides. At least one port is located on at least one of the front and back sides of the housing and configured to receive an end plug of a network cable and communicatively coupled to the one or more components. The housing includes at least one opening formed on at least one of the front and back sides, where the opening is configured to allow the network cable to pass therethrough. At least one side of the housing defines a space so as to allow the network cable to travel between the front side to the back side through the opening and the space.

An electronic device having a heat dissipation function is proposed. The electronic device includes: a heating element (20); a shield can (30) covering the heating element (20) to block electromagnetic waves; and a heat dissipation means (50) provided to be adjacent to the heating element (20) and causing an ionic wind to flow into a shielded space (32) of an inner part of the shield can (30). Here, the heat dissipation means (50) includes: a wire electrode (70) provided to be adjacent to an entrance of the shielded space (32) of the shield can (30) and becoming an emitter electrode; and a power module (80) connected to the wire electrode (70) and applying voltage to the wire electrode (70), wherein the shield can (30) is grounded at the same time of being connected to the power module (80) and becomes a collector electrode.