A transfer tube for a thermal transfer device can include at least one wall having an inner surface and an outer surface, where the inner surface forms a cavity, where the at least one wall further has a first end and a second end. The first end can be configured to couple to a terminus of a heat exchanger of the thermal transfer device. The second end can be configured to couple to a collector box of the thermal transfer device. At least a portion of the at least one wall can be disposed in a vestibule of the thermal transfer device. The cavity can be configured to simultaneously receive a first fluid that flows from the first end to the second end and a second fluid that flows from the second end to the first end.

A method of forming an polymer composites is disclosed herein that includes infiltrating CNT sponges with a polymer or metal to form a composite. The method uses a relatively easy, scalable, and low-cost synthesis process that makes the composites attractive as TIM. CNTs in the sponge structure are covalently bonded, resulting in a low Young's modulus while at the same time maintaining a good thermal conductivity. This strategy makes it possible to obtain both high deformability and high thermal conductivity, which are difficult to have simultaneously due to their adverse correlation.

A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C..Math.cm.sup.2/W or less.

Provided is a metal matrix nanocomposite comprising: (a) a metal or metal alloy as a matrix material; and (b) multiple graphene sheets that are dispersed in said matrix material, wherein said multiple graphene sheets are substantially aligned to be parallel to one another and are in an amount from 0.1% to 95% by volume based on the total nanocomposite volume; wherein the multiple graphene sheets contain single-layer or few-layer graphene sheets selected from pristine graphene, graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof and wherein the chemically functionalized graphene is not graphene oxide. The metal matrix exhibits a combination of exceptional tensile strength, modulus, thermal conductivity, and/or electrical conductivity.

A multilayered material system includes at least one of a liner sheet and a cellular core, and a multilayered composite joined to the at least one of a liner sheet and a cellular core. The multilayered composite includes hollow microspheres dispersed within a metallic matrix material.

The invention provides in one embodiment a heat exchanger module (1) comprising a) a flexible support (100); b) at least one tubular member (200) having its main axis substantially parallel with the plane of the flexible support (100); c) a conductive flexible matrix (300) embedding the at least one tubular member (200); and d) a flexible case (400) enwrapping the flexible support (100), the at least one tubular member (200) and the conductive flexible matrix (300). A coating for a built environment comprising a plurality of heat exchanger modules (1) can be implemented, as well as a system further including pumping means (600). The invention also foresees a method for providing heat exchange processes between the heat exchanger module (1), the coating or the system of the invention and a built environment.

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

Embodiments described herein generally relate to a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core surrounded by an outer core having a thickness and an outer surface. A composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The composite material pattern in combination with an optimized emissivity surface coating/paint profile directs a heat from the inner core to an object other than the emitter device.

The present technology provides a non-cylindrical structure for transporting media, including gases, liquids, solids, or energy comprising a layer of thermal pyrolytic graphite (TPG) surrounded by an outer layer and an inner layer comprising a metal, a ceramic, a glass, or a plastic. In particular, the present technology relates to a non-cylindrical tube or a pipe having an inner layer, an outer layer, and a layer of TPG between the inner layer and the outer layer wherein the TPG layer is configured to manage the direction of heat conduction.

Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.