A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.

A heat exchanger suitable to be used as a recuperator in a micro gas turbine including a stack of cells. Each of the cells includes a pair of mutually spaced-apart plates and layers including heat exchange elements arranged at the outer surfaces of the plates and between the plates. Each of the layers including heat exchange elements can include at least one discrete spatial component incorporating a number of elements. Both a supply header and a discharge header of the heat exchanger can be made of only two components at the position of the stack of cells. Compensating for heat expansion effects can be via a bellows-shaped pipe portion of a supply conduit.

A heat exchanger suitable to be used as a recuperator in a micro gas turbine including a stack of cells. Each of the cells includes a pair of mutually spaced-apart plates and layers including heat exchange elements arranged at the outer surfaces of the plates and between the plates. Each of the layers including heat exchange elements can include at least one discrete spatial component incorporating a number of elements. Both a supply header and a discharge header of the heat exchanger can be made of only two components at the position of the stack of cells. Compensating for heat expansion effects can be via a bellows-shaped pipe portion of a supply conduit.

A stacked plate heat exchanger for a motor vehicle is disclosed. The stacked plate heat exchanger includes a plurality of elongated stacked plates extending in a longitudinal direction and stacked against one another perpendicularly to the longitudinal direction in a stacking direction. First hollow spaces and second hollow spaces are disposed between adjacent stacked plates, through which alternatingly a first medium and a second medium flows. At least one stacked plate has a rib structure disposed on a respective plate surface, structured and arranged to provide a plurality of flow passages within the respective hollow space. The rib structure has a guiding region and two distribution regions. The rib structure differs in the guiding region and in the two distribution regions by shape and size of the plurality of flow passages.

A stacked plate heat exchanger for a motor vehicle is disclosed. The stacked plate heat exchanger includes a plurality of elongated stacked plates extending in a longitudinal direction and stacked against one another perpendicularly to the longitudinal direction in a stacking direction. First hollow spaces and second hollow spaces are disposed between adjacent stacked plates, through which alternatingly a first medium and a second medium flows. At least one stacked plate has a rib structure disposed on a respective plate surface, structured and arranged to provide a plurality of flow passages within the respective hollow space. The rib structure has a guiding region and two distribution regions. The rib structure differs in the guiding region and in the two distribution regions by shape and size of the plurality of flow passages.

A heat exchange structure includes: two flow channels stacked in a stacking direction (Y direction) and thermally coupled to each other; and a fin structure detachably installed in at least one flow channel of the two flow channels. The fin structure includes fins arranged in a longitudinal direction (Z direction) of the at least one flow channel in which the fin structure is installed, the fins configured to form openings alternately arranged along the at least one flow channel on one side and the other side of the at least one flow channel in a width direction (X direction).