A heat exchanger having a stack of multiple plates which are parallel to one another and to a longitudinal direction, and stacked spaced apart from one another so as to define, between one another, a first series of passages for the flow of at least a first fluid in an overall flow direction parallel to the longitudinal direction, each passage being delimited by closure bars disposed between the plates. A filtering device is arranged in at least one passage of the first series, the filtering device extending for the one part between two adjacent plates defining the passage and for the other part between two of the closure bars delimiting the passage, the filtering device having a metal sheet material chosen from among a metal fabric, a nonwoven of metal fibres, a sintered metal powder or sintered metal fibres, a metal foam, or a microperforated plate.

The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. An area of the wick is larger than an area of a region corresponding to the microchannel in a plan view of the vapor chamber.

Methods and systems are provided for a heat exchanger. In one example, the heat exchanger may dissipate energy generated by a battery module and may include a first plate and a second plate arranged in opposed facing relation to one another. A plurality of flow passages may be formed between the first and second plates, the plurality of flow passages including at least one multipass fluid flow passage with at least three longitudinally-extending legs.

The present invention is related to a laminated thin heat dissipation device mainly comprising an upper plate, at least one first layer plate, at least one second layer plate, a lower plate and a working fluid, the first, second layer plates having at least one first, second hollow slots respectively, wherein the upper plate, the first layer plate, the second layer plate and the lower plate are laminated to form a hollow body, the first hollow slot and the second hollow slot are communicated with each other and form an enclosed chamber, the enclosed chamber includes at least one first fluid channel and at least one second fluid channel, the enclosed chamber of the hollow body is filled with the working fluid, the first fluid channel serves as a vapor flow path, and the second fluid channel serves as a condensed fluid flow path.

There is disclosed a heat exchanger comprising: a plurality of first fluid channels, a plurality of conduits for interconnecting the first fluid channels, a plurality of second fluid channels, a plurality of conduits for interconnecting the second fluid channels, wherein the heat exchanger is configured as a plurality of repeating units, each repeating unit comprising: a base plate comprising a first opening, and a first conduit extending from the plate, the shape of the opening corresponding to the shape of the conduit.

A heat exchange structure includes: two flow channels stacked in a stacking direction (Y direction) and thermally coupled to each other; and a fin structure detachably installed in at least one flow channel of the two flow channels. The fin structure includes fins arranged in a longitudinal direction (Z direction) of the at least one flow channel in which the fin structure is installed, the fins configured to form openings alternately arranged along the at least one flow channel on one side and the other side of the at least one flow channel in the stacking direction.

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing and is in contact with the microchannel. A contact area between the wick and the microchannel is 5% to 40% with respect to an area of the internal space taken as a plane.

A heat exchanger with at least one plate includes main dimples between which secondary dimples are formed which are flatter and/or smaller with respect to their dimensions as seen in a plan view. A depth of the secondary dimples may be at most 0.5 times a channel height and/or at most 0.5 times the depth of the main dimples.

A plate heat exchanger includes heat exchange plates and a port, and the port communicates with a predetermined heat exchange space of a plurality of heat exchange spaces. The heat exchange plates of the plate heat exchanger includes a plurality of first heat exchange plates and a plurality of second heat exchange plates. The first heat exchange plate includes: a first heat exchange plate main body; a first opening formed in the first heat exchange plate main body for forming the port; and a first annular protrusion surrounding the first opening, adjoining the first opening and protruding from the first heat exchange plate main body toward a first side in a stacking direction. The second heat exchange plate includes: a second heat exchange plate main body; a second opening formed in the second heat exchange plate main body for forming the port; and a second annular protrusion surrounding the second opening, adjoining the second opening and protruding from the second heat exchange plate main body toward a second side opposite the first side in the stacking direction. The plate heat exchanger according to the embodiments of the present invention can simplify the manufacturing process of the plate heat exchanger, for example.