Patent classifications
G01B11/12
NON-CONTACT OPTICAL MEASUREMENT DEVICES AND EXCHANGEABLE OPTICAL PROBES
Disclosed is a non-contact optical measurement device for detecting or measuring different geometric workpiece features based on configurable light-propagation paths of light emitted from a light source and reflected by a workpiece surface for incidence upon a spectral sensor. The light-propagation paths are configurable based on which optical probe is attached to a rotation stage that rotates the probe about an optical axis and in a collimated region.
NON-CONTACT OPTICAL MEASUREMENT DEVICES AND EXCHANGEABLE OPTICAL PROBES
Disclosed is a non-contact optical measurement device for detecting or measuring different geometric workpiece features based on configurable light-propagation paths of light emitted from a light source and reflected by a workpiece surface for incidence upon a spectral sensor. The light-propagation paths are configurable based on which optical probe is attached to a rotation stage that rotates the probe about an optical axis and in a collimated region.
Device for determining a layer thickness in a multilayer film
A device for determining a layer thickness in a multilayer film includes a radiation source configured to generate an electromagnetic primary radiation, a detector configured to detect an electromagnetic secondary radiation emitted by the multilayer film, the secondary radiation being induced by an interaction of the primary radiation with the multilayer film, and a first contact block transparent to the electromagnetic primary radiation and having a first contact surface for creating contact with the multilayer film. The radiation source is arranged on the first contact block in such a way that the electromagnetic primary radiation is guided from the first contact block onto the multilayer film.
Device for determining a layer thickness in a multilayer film
A device for determining a layer thickness in a multilayer film includes a radiation source configured to generate an electromagnetic primary radiation, a detector configured to detect an electromagnetic secondary radiation emitted by the multilayer film, the secondary radiation being induced by an interaction of the primary radiation with the multilayer film, and a first contact block transparent to the electromagnetic primary radiation and having a first contact surface for creating contact with the multilayer film. The radiation source is arranged on the first contact block in such a way that the electromagnetic primary radiation is guided from the first contact block onto the multilayer film.
Feeding device of hole inspection device
According to one implementation, a feeding device of a hole inspection device having a probe includes an attaching jig, a movement mechanism, and a positioning jig. The probe is inserted into a hole to be inspected of an object in a central axis direction of the hole, for inspecting the hole. The attaching jig attaches the hole inspection device to the feeding device. The movement mechanism linearly reciprocates the hole inspection device together with the attaching jig. The positioning jig positions the movement mechanism to the object. A moving direction of the attaching jig and the hole inspection device is made parallel to the central axis direction of the hole by positioning the movement mechanism.
Method and terminal for generating an index of compatibility between two ends of two tubes, and tube provided with an angular marking
Method for generating a compatibility index between two ends of two tubes, in particular before welding operations, the method comprising the steps of: (a) marking an angular reference (M0) on each of the two ends, (b) orbital measurement of an inside radius of each of the ends; (c) determining an index of angular compatibility (IND.sub.thētak) between the two ends for an angular deviation (⊖, theta) between the angular references of the ends, said angular compatibility index deriving from a maximum difference between the inside radii of each opposite end, (d) iterating the step of determining the angular compatibility index for several values for angular deviation between the angular references of the ends; (e) generating an overall score for compatibility (Hk) between said two ends, the overall compatibility score being a function of the angular compatibility indices determined for several angular deviation values.
Method and system for map-free inspection of semiconductor devices
A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.
Method ad Apparatus for Digital Thread Inspection
A compact inspection assembly comprising digital sensors and/or laser measurement systems to measure and validate attributes of pipe and associated threaded connections. A custom designed end-effector sensor assembly is selectively attached to a robotic arm having software and control systems. An automated sensor assembly, selectively positioned relative to a pipe section, measures data regarding the pipe and associated threaded connections. The measured and recorded data can be inspected for defects and/or compared to predetermined standards (such as, for example, original equipment manufacturer and/or end user specifications or requirements) to verify pipe/connection compliance with desired standards.
Method ad Apparatus for Digital Thread Inspection
A compact inspection assembly comprising digital sensors and/or laser measurement systems to measure and validate attributes of pipe and associated threaded connections. A custom designed end-effector sensor assembly is selectively attached to a robotic arm having software and control systems. An automated sensor assembly, selectively positioned relative to a pipe section, measures data regarding the pipe and associated threaded connections. The measured and recorded data can be inspected for defects and/or compared to predetermined standards (such as, for example, original equipment manufacturer and/or end user specifications or requirements) to verify pipe/connection compliance with desired standards.
TIP CALIBRATION IN AN ADDITIVE MANUFACTURING SYSTEM
A method for calibrating a 3D printer includes the steps of providing information obtained in a factory calibration indicating a center of an inner diameter of a tip orifice in a metal extrusion nozzle and a center of a tip surface for the nozzle and inductively sensing the nozzle with an eddy current sensor when secured to a print head on a gantry or robotic arm of the 3D printer to identify a sensed location of the center of the tip surface of the nozzle. The method includes determining a location of the center of the inner diameter of the tip orifice on the nozzle on the print head and utilizing the provided information to locate the center of the inner diameter of the tip orifice.