Patent classifications
G01J1/0204
Optical Detector Module and a Method for Operating the Same
An optical detector module can be used to implement proximity sensing function by detecting ambient light outside of the optical detector module in accordance with a first detection threshold. An optical detector module can be further used to implement other active functions such as material detection (e.g., skin) or depth-sensing by emitting one or more optical signals (e.g., light pulses at a specific wavelength) and detecting the reflected optical signals relative to a second and/or third detection threshold. The disclosure provides technical solutions for actively monitoring detection threshold(s) of an optical detector module to achieve better power management. In some embodiments, such solutions are useful for photodetectors having a wide sensing bandwidth, such as a photodetector formed in germanium or a photodetector comprising an absorption region comprising germanium.
Cryogenic microfluidic cooling for photonic integrated circuits
Techniques disclosed herein relate generally to photonic integrated circuits working at cryogenic temperatures. In one example, a device includes a substrate, a dielectric layer on the substrate, an optical waveguide in the dielectric layer, a superconducting circuit in the dielectric layer and coupled to the optical waveguide, and a micro-channel in the dielectric layer and adjacent to the superconducting circuit. The micro-channel is aligned with the superconducting circuit and is configured to conduct a liquid at a cryogenic temperature to locally cool the superconducting circuit.
Electronic device for controlling light emitting elements of optical sensor module based on display signal line voltage and operating method of electronic device
An example electronic device includes: a housing: a display including a plurality of signal lines; an optical sensor module including first and second light emitting elements respectively overlapping first and second signal lines, and a light receiving element configured to collect light from the first and/or second light emitting elements that is reflected and received from an external object; and a processor. The processor is configured to control the first light emitting element based on an off-time point of time of the first signal line corresponding to brightness of the display such that the first light emitting element emits light at a first light-emitting point of time, and to control the second light emitting element based on a time difference between off-time points of time of the first and second signal lines such that the second light emitting element emits light at a second light-emitting point of time.
Method for preventing mistouch by using top-emitted proximity light, and terminal
Embodiments provide a proximity sensor located at a side edge of a terminal or a top side edge of the terminal. A first included angle is formed between light emitted by the proximity sensor and a touchscreen of the terminal. The terminal obtains data detected by a motion sensor, and motion data of the terminal based on the data detected by the motion sensor. The terminal determines whether the motion data is less than a first threshold. If the motion data is less than the first threshold, the terminal determines that no external object is currently approaching, and skips performing a mistouch prevention action. If the motion data is greater than or equal to the first threshold, the terminal determines, based on data detected by the proximity sensor, whether an external object is approaching, and determines, based on a determining result, whether to subsequently perform the mistouch prevention action.
IMAGE SENSOR SYSTEM
An optical sensor system may include a light source. The optical sensor system may include a concentrator component proximate to the light source and configured to concentrate light from the light source with respect to a measurement target. The optical sensor system may include a collection component that includes an array of at least two components configured to receive light reflected or transmitted from the measurement target. The optical sensor system may include may a sensor. The optical sensor system may include a filter provided between the collection component and the sensor.
Sensor module and method for operating the same
Disclosed are a sensor module and a method for operating the same. The sensor module includes a module unit including a first body having a cavity and a module substrate received in the first body; and a sensor unit including a second body detachable from the cavity of the module unit and a sensor received in the second body, wherein the module unit reads an output signal from the sensor unit to generate sensing information and wirelessly outputs the sensing information.
METHOD AND APPARATUS OR DETERMINING PRESENCE AND OPERATION OF COMPONENTS IN A PRINTED CIRCUIT BOARD
A method and apparatus for determining a presence, color and/or brightness of a plurality of components in a printed circuit board, where the components are biased either with constant current or with a current pulse.
Packaged optical device having a specular reflection configuration
A packaged optical device includes a light source device emitting light to an object surface, a sensor chip receiving reflective light reflected from the object surface, and a non-lens transparency layer located in front of the sensor chip. The light and the reflective light have a first main optic axis and a second main optic axis, respectively, and the first main optic axis and the second main optic axis are configured to form the specular reflection configuration, thereby enhancing images received by the sensor chip. The non-lens transparency layer has a zone passed through by the second main optic axis, and transmittance of the zone is lower than that of other zones of the non-lens transparency layer, thereby preventing the sensor chip from being saturated.
Electronic device enclosure including a glass ceramic region
An electronic device including an optical component and an enclosure comprising a glass ceramic region is disclosed. The optical properties of the glass ceramic region and the positioning of the glass ceramic region with respect to the optical component can affect the performance of the optical component, the visual appearance of the optical component, or both.
WAFER LEVEL PACKAGING OF INFRARED CAMERA DETECTORS
An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.